Adhesion Between Sputter-Deposited Polymer Films and Metal Substrates.

1.薄聚合物薄膜被沉积在各种聚合物的基底（玻璃、铜和镍板）上。表面纹理和薄膜的沉积过程是通过扫描电镜和非接触性测定仪的意义进行的。特别地，用人造的PTFE薄膜，用ESCA测试了薄膜的分子结构，并对薄膜和某些金属之间的粘合剂、关键磁盘革命（Frictional Durability）和关键负载进行了测量，根据一个恒定负载和一个单一的负载增加，以一个恒定速率和一个单一的负载增加进行了调查。如果添加到这些刮擦测试中，张紧拉测试也是有效的。2.（1）通过喷射技术的电影沉积率也低于真空蒸发技术的电影沉积率，该技术的质量（表面粗糙度，无针孔）是蒸发膜的至高无上者。（2）该植物的含量 ... More Sputter-Deposed PTFE低于散装PTFE，并依赖于Sputtering Condition。C_<1sn>ESCA spectrum of sputter-deposited PTFE films exhibited very broad spectrum band composed of four components in contrast to a nrow single spectrum of bulk PTFE. ESCA的结果建议说，卫星沉积的PTFE薄膜的分子链有许多分支和交叉链接，和/或低于那些散装PTFE的分子重量。（3） Under the two types of scratch tests， the variation of friction force and AE event count rate were observedcorres ponding to an initiation of the film damage。（4） The critical disk devolution and the critical load取决于聚合物薄膜的类型、sputtering conditions and the type of the substrate。（5）在散布的PTFE薄膜和蒸发的金属薄膜之间的粘合高于散装PTFE和蒸发的金属薄膜之间的粘合，以及在较低压力下沉积的薄膜被暴露在较高压力下的较高的粘合剂比蒸发的金属薄膜被沉积在较高压力下。Less（低）

1. Thin polymer films were deposited on kinds of substrates (glass, copper and nickel plates) by RF-sputtering various polymers. The surface texture and the deposition process of the films were examined by means of SEM and non-contacting profilometer. Especially, with the sputter-deposited PTFE films, molecular structure of the film were examined by ESCA, and to investigate the adhesion between the films and some metals, critical disk revolutions (frictional durability) and critical load were measured by means of a multipleーscratch test under a constant load and a single-scratch test under a load increasing at a constant rate, respectively. In addition to these scratch tests, the tensile pull test was also carried out. 2. (1) Although the film deposition rate by sputtering technique was lower than that by vacuum evaporation technique, the quality (surface roughness, pinーhole free) of the sputter-deposited films were superior to that of evaporated films. (2) The fluorine content of the … More sputter-deposited PTFE was lower than that of bulk PTFE, and depend on the sputtering condition. C_<1sn> ESCA spectrum of sputter-deposited PTFE films exhibited very broad spectrum band composed of four components in contrast to a narrow single spectrum of bulk PTFE. The ESCA results suggested that the molecular chains of the sputter-deposited PTFE film had many branches and crosslinks and/or lower molecular weight than those of bulk PTFE. (3) Under the two types of scratch tests, the variation of friction force and AE event count rate were observedcorres ponding to an initiation of the film damage. (4) The critical disk devolution and the critical load were depend on the type of the polymer films, sputtering conditions and the type of the substrate. (5) The adhesion between the sputter-deposited PTFE films and the evaporated metal films were higher than that between bulk PTFE and the evaporated metal films, and the films deposited under a lower pressure exhibited higher adhesion to the evaporated metal films than the films deposited under a higher pressure. Less