Engineering Research Equipment Grant: Reactive-Ion-Etcher/ PECVD/RF-Sputtering Equipment for Fabrication of Micro Electro-Mechanical Systems"

工程研究设备补助金：用于制造微机电系统的反应离子蚀刻机/ PECVD/射频溅射设备”

• 批准号: 8806449
• 负责人: John Wood
• 金额: $ 4.6万
• 依托单位: University of Utah
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1988
• 资助国家: 美国
• 起止时间: 1988-07-01 至 1989-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=8806449&HistoricalAwards=false
• 关键词: Engineering; Research; Equipment; Grant; Reactive

This is a Research Equipment Grant for reactive-ion-etcher/PECVD/RF- sputtering equipment to be used in research on microelectromechanical devices. This research project focuses on the design, analysis, and fabrication of devices with single or numerous micron-scale internal components forming either moveable mechanical elements, which are actuated by strong fields, or sensor elements, which infer relative positions of components based on local fields. Devices to be produced using this equipment include sensors -- such as strain gauges, micropositioners, and multi-axis tactile sensors -- spatial light modulators, and actuators. Crucial to the design of these devices is the ability to build deep or complete cut-outs into the structure, and to pattern metals, insulator and magnetic materials. This equipment will allow the on-site generation of microelectromechanical devices requiring vertical etching principally in silicon-based materials, and the generation of such devices requiring deposition of conductors, insulators, and magnetic films.

这是一个研究设备赠款的反应离子蚀刻/PECVD/RF- 用于微机电研究的溅射设备 装置. 该研究项目的重点是设计，分析， 制造具有单个或多个微米级内部 形成可移动机械元件的部件， 由强场或传感器元件驱动， 基于局部字段的零部件位置。 待生产器械 使用这种设备包括传感器--例如应变仪， 微定位器和多轴触觉传感器--空间光 调制器和致动器。 设计这些设备的关键是 在结构中建立深或完整切口的能力，以及 用于图案化金属、绝缘体和磁性材料。 本设备 将允许现场生成微机电设备， 主要在硅基材料中需要垂直蚀刻，以及 这种器件的产生需要沉积导体， 绝缘体和磁性薄膜。