Fabrication of Micro/Millimeter Wave Integrated Circuit by Novel Ferrite Plating Enhanced by Laser

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The purpose of this study was to fabricate micro/millimeter wave devices in which ferrite-film nonreciprocal circuits (i.e.isolators and circulators) prepared by the novel laser-enhanced ferrite plating are integrated. The ferrite plating is low in process temperature (<100 C), and, when enhanced by laser beams, high in deposition rate and capable of selective area deposition by scanning. The plated films of NiZn and MnZn spinel ferrites were found to be highly lossy at microwave freguency. This was because concentration of Ni and Mn was low which gave rise Fe^<2+> ions in the spinel lattice. Therefore, we have developed a novel ferrite plating method utilizing highly alkaline aqueous solution of chelated Fe and other metal ions, by which the Ni and Mn concentration were successfully increased. Furthermore, we have fabricated films of hexagonal Ba-ferrite by novel electro-ferrite plating utilizing alternate electric current. The dielectric loss in the plated films of NiZn and MnZn ferrites were successfully reduced by exposing the films in vacuum at room temperature, without deteriorating their magnetic characteristics. We could not, unfortunately, realize the microwave/millimeter-wave devices integrated with the non-reciprocal ferrite devices, however, we have shown the potential feasibility to fabricate them.