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Studies on micro flow sensor for ultra high speed flow and ultra low speed flow

超高速流和超低速流微流量传感器的研究

基本信息

批准号：
07650513
负责人：
SHOJI Shuichi
金额：
$ 1.28万
依托单位：
Waseda University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1995
资助国家：
日本
起止时间：
1995 至 1996
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07650513/
关键词：
Micro flow sensor Micro flow device Micro total analysis system Flow sensing Microchannel Low temperature anodic bonding Microfluidics Micromachining フローセンサマイクロセンサ超高速流粘性マイクロ理工学

项目摘要

The results of our studies are listed below.1. Fabrication of wing type micro flow sensors for ultra high speed flow measurementsRectangular wing supported by 4 fine beams located in a microchannel was designed. The micro structures were fabricated using selective etching method of the highly boron doped p+ layr and Si-to-glass anodic bonding method. The sensor consists of 4 wafers of glass-Si-Si-glass and the micro channel was formed in the 2 Si wafers. The displacement of the wing caused by the lift force under gas flow is measured by the laser interferometric displacement sensor. Many types of wing having different sizes of the chord, length etc.was fabricated and tested. The aspect ratio, ratio between the length and the chord, is important for characterization of the sensor. The relationship between the displacement and flow speed was measured using compressed air as the gas flow. The wing having high aspect ratio shows high sensitivity. The residual stress, however, reduce the sensitivity of the sensor. We are going to improve the structure and fabrication process.2. Design of thermal micro flow sensor for ultra low speed flow measurementMicro flow sensor consists of two micro resistor heater/thermal sensor having very small thermal copacitance was designed. It is now on fabrication using the same methods of wing type micro flow sensor.3. Characterization of fluidics in microchannelVarious kinds of micro channels were fabricated and their flow characteristics were measured. The results were very useful for the designing of micro flow devices and micro total analysis systems.4. Low temperature anodic bonding methodTo reduce the residual stress coused by the anodic bonding, anodic bonding using lithium-aluminosilicate glass-ceramic was studied. The bonding tenperature can be reduced to 60C (conventionally 400C) with the glass ceramic. The bonding method is also very useful for packaging of the microsensors and the assemblying of the micro total analysis systems.

我们的研究结果列在下面。用于超高速流量测量的翼型微流量传感器的制作设计了由4根细梁支承在微通道中的矩形机翼。采用高硼掺杂p+层的选择性蚀刻法和硅-玻璃阳极键合法制备了微结构。该传感器由4片硅-硅-玻璃晶片组成，微通道在2片硅晶片上形成。利用激光干涉位移传感器测量了气流作用下由升力引起的机翼位移。制作并试验了多种不同弦长、弦长等尺寸的机翼。宽高比，即长度与弦的比值，对于传感器的特性是很重要的。以压缩空气为气体流，测量了排量与流速的关系。高展弦比的机翼灵敏度高。然而，残余应力降低了传感器的灵敏度。我们将改进结构和制造工艺。用于超低转速流量测量的热微流量传感器设计微流量传感器由两个微电阻加热器/热容非常小的热传感器组成。目前正采用相同的方法制造翼型微流量传感器。制备了多种微通道，并对其流动特性进行了测量。所得结果对微流动装置和微总量分析系统的设计具有一定的参考价值。低温阳极键合方法为了降低阳极键合过程中产生的残余应力，对锂铝硅酸盐玻璃陶瓷进行了阳极键合研究。与玻璃陶瓷的粘合温度可以降低到60C（传统的400C）。这种键合方法对于微传感器的封装和微全分析系统的组装也非常有用。