权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

Studies on micro flow sensor for ultra high speed flow and ultra low speed flow

超高速流和超低速流微流量传感器的研究

基本信息

批准号：
07650513
负责人：
SHOJI Shuichi
金额：
$ 1.28万
依托单位：
Waseda University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1995
资助国家：
日本
起止时间：
1995 至 1996
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07650513/
关键词：
Micro flow sensor Micro flow device Micro total analysis system Flow sensing Microchannel Low temperature anodic bonding Microfluidics Micromachining フローセンサマイクロセンサ超高速流粘性マイクロ理工学

项目摘要

The results of our studies are listed below.1. Fabrication of wing type micro flow sensors for ultra high speed flow measurementsRectangular wing supported by 4 fine beams located in a microchannel was designed. The micro structures were fabricated using selective etching method of the highly boron doped p+ layr and Si-to-glass anodic bonding method. The sensor consists of 4 wafers of glass-Si-Si-glass and the micro channel was formed in the 2 Si wafers. The displacement of the wing caused by the lift force under gas flow is measured by the laser interferometric displacement sensor. Many types of wing having different sizes of the chord, length etc.was fabricated and tested. The aspect ratio, ratio between the length and the chord, is important for characterization of the sensor. The relationship between the displacement and flow speed was measured using compressed air as the gas flow. The wing having high aspect ratio shows high sensitivity. The residual stress, however, reduce the sensitivity of the sensor. We are going to improve the structure and fabrication process.2. Design of thermal micro flow sensor for ultra low speed flow measurementMicro flow sensor consists of two micro resistor heater/thermal sensor having very small thermal copacitance was designed. It is now on fabrication using the same methods of wing type micro flow sensor.3. Characterization of fluidics in microchannelVarious kinds of micro channels were fabricated and their flow characteristics were measured. The results were very useful for the designing of micro flow devices and micro total analysis systems.4. Low temperature anodic bonding methodTo reduce the residual stress coused by the anodic bonding, anodic bonding using lithium-aluminosilicate glass-ceramic was studied. The bonding tenperature can be reduced to 60C (conventionally 400C) with the glass ceramic. The bonding method is also very useful for packaging of the microsensors and the assemblying of the micro total analysis systems.

我们的研究结果列在下面。翼式超高速微流量传感器的研制设计了一种由四根微梁支撑的矩形翼，翼位于微通道内。微结构的制作采用高掺硼p+层的选择性刻蚀方法和Si-玻璃阳极键合方法。该传感器由4片玻璃-硅-硅-玻璃组成，在2片硅晶片上形成微通道。利用激光干涉位移传感器测量了机翼在气流作用下升力引起的位移。制造并试验了具有不同弦长、长度等尺寸的多种机翼。纵横比，长度与弦之间的比率，对于传感器的表征是重要的。使用压缩空气作为气体流测量位移和流速之间的关系。大展弦比的机翼表现出高灵敏度。然而，残余应力降低了传感器的灵敏度。我们将改进结构和制造工艺。用于超低速流量测量的热式微流量传感器设计设计了由两个微电阻加热器/热传感器组成的微流量传感器，具有很小的热容差。目前正在采用与翼式微流量传感器相同的方法进行制作.微通道内流体力学特性研究制作了各种微通道，并对其流动特性进行了测试。研究结果对微流控装置和微全分析系统的设计具有重要的指导意义.低温阳极键合法为了降低阳极键合产生的残余应力，研究了锂铝硅酸盐微晶玻璃的低温阳极键合方法。与玻璃陶瓷的键合温度可以降低到60 ℃（常规为400 ℃）。这种键合方法对于微传感器的封装和微全分析系统的组装也是非常有用的。