Studies on Integration and Packaging Technologies for Health Information Monitoring Microsystems

健康信息监测微系统集成封装技术研究

基本信息

批准号：
09650491
负责人：
SHOJI Shuichi
金额：
$ 2.5万
依托单位：
Waseda University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1997
资助国家：
日本
起止时间：
1997 至 1998
项目状态：
已结题

项目摘要

Integration and packaging technologies of sensors and circuits to realize wire-less bio-monitoring microsystems for human health care and sick prevention have been studied these two years.Fabrication of the ECG monitoring microsystem consists of three ECG detecting electrodes, an amplifierand transmitter, which can be set at the chest is one of the final goals of the project. Two types custom IC of transmitter of PWM and FM, and amplifier were designed and fabricated using the multi-chip IC service project of the Institute of Electric Engineering of Japan. The demodulation circuit using PLL for the relay transmitter set at the wrist was also designed and fabricated with the discrete circuits. It is going to be fabricated with custom IC.The FM type system showed better ECG signal quality but the PWM type system stands up the noise. The muiti-microsensor chip of pressure, temperature and pH sensing was fabricated for realizing micro capsule for the monitoring of the digestive tract. The micro chip was designed considering the packaging. The detection and PWM transmission circuit of pH sensor was also designed and fabricated with custom IC.In order to realize the micropackaging of the systems, low temperature SiO2-SiO2 bonding technology using diluted HF solution have been developed. The bonding was achieved at the room temperature but 24 hours is necessary before the bonding completed. Elevating the bonding temperature to 60ﾟC or 80ﾟC is effective to reduce the bonding time. It is investigated that the hermetic seal packaging can be realized by the HF bonding.

传感器和电路的集成和包装技术实现了这两年的无线生物监测微观系统，用于人类医疗保健和病人预防的微型系统。这两年已经进行了工作室。对ECG监控微系统组成的构造由三个ECG构成，检测电极，是一个可以放大器和发射器的电极，可以在胸部进行射击。使用日本电动工程研究所的多芯片IC服务项目设计和制造了两种类型的PWM和FM发射器以及放大器的自定义IC。还使用离散电路设计和制造了使用PLL进行继电器发射器集的解调电路。它将用自定义IC进行制造。FM类型系统显示出更好的ECG信号质量，但PWM类型系统却构成了噪音。制造了压力，温度和pH感应的肌动质芯片，以实现微囊，以监测消化道。考虑包装的微芯片是设计的。还通过自定义IC设计和制造了pH传感器的检测和PWM传输电路，以实现系统的微型包装，已经开发了使用稀释的HF溶液的低温SIO2-SIO2键合技术。在室温下实现键合，但在结合完成之前需要24小时。将粘结温度升至60°C或80°C可有效减少粘结时间。研究了HF键合可以实现密封包装。