Studies on Integration and Packaging Technologies for Health Information Monitoring Microsystems

这两年研究了传感器和电路的集成和封装技术，以实现用于人体健康和疾病预防的无线生物监测微系统。心电监测微系统的研制是本课题的最终目标之一，该系统由三个心电检测电极、一个放大器和发射器组成，并可设置在胸部。利用日本电气工程研究所的多芯片集成电路服务项目，设计制作了PWM和FM发射机和放大器两种定制集成电路。用离散电路设计并制作了腕部中继发射机的锁相环解调电路。结果表明，调频型系统具有较好的心电信号质量，而PWM型系统具有较强的抗干扰能力。为实现消化道监测微胶囊，制作了压力、温度和pH传感的多微传感器芯片。微芯片的设计考虑了封装。采用定制集成电路设计和制作了pH传感器的检测和PWM传输电路。为了实现系统的微封装，开发了稀释HF溶液的低温SiO2-SiO2键合技术。在室温下实现了粘合，但在粘合完成之前需要24小时。将连接温度提高到60或80 C，可以有效缩短连接时间。研究了利用高频键合实现密封封装的可行性。

Integration and packaging technologies of sensors and circuits to realize wire-less bio-monitoring microsystems for human health care and sick prevention have been studied these two years.Fabrication of the ECG monitoring microsystem consists of three ECG detecting electrodes, an amplifierand transmitter, which can be set at the chest is one of the final goals of the project. Two types custom IC of transmitter of PWM and FM, and amplifier were designed and fabricated using the multi-chip IC service project of the Institute of Electric Engineering of Japan. The demodulation circuit using PLL for the relay transmitter set at the wrist was also designed and fabricated with the discrete circuits. It is going to be fabricated with custom IC.The FM type system showed better ECG signal quality but the PWM type system stands up the noise. The muiti-microsensor chip of pressure, temperature and pH sensing was fabricated for realizing micro capsule for the monitoring of the digestive tract. The micro chip was designed considering the packaging. The detection and PWM transmission circuit of pH sensor was also designed and fabricated with custom IC.In order to realize the micropackaging of the systems, low temperature SiO2-SiO2 bonding technology using diluted HF solution have been developed. The bonding was achieved at the room temperature but 24 hours is necessary before the bonding completed. Elevating the bonding temperature to 60ﾟC or 80ﾟC is effective to reduce the bonding time. It is investigated that the hermetic seal packaging can be realized by the HF bonding.