Studies on Integration and Packaging Technologies for Health Information Monitoring Microsystems

近两年研究了传感器和电路的集成和封装技术，以实现用于人类保健和疾病预防的无线生物监测微系统。制作由三个心电检测电极、一个放大器和发射器组成的可放置在胸部的心电监测微系统是该项目的最终目标之一。利用日本电气工程研究所的多芯片IC服务项目设计和制造了两种类型的PWM和FM发射器以及放大器的定制IC。腕部中继发射器采用PLL的解调电路也采用分立电路设计和制作。它将用定制 IC 制造。FM 类型系统显示出更好的 ECG 信号质量，但 PWM 类型系统可以承受噪声。制作了压力、温度和pH传感的多微传感器芯片，以实现消化道监测的微胶囊。微芯片的设计考虑了封装。 pH传感器的检测和PWM传输电路也采用定制IC设计和制作。为了实现系统的微封装，开发了使用稀HF溶液的低温SiO2-SiO2键合技术。粘合在室温下实现，但粘合完成之前需要24小时。将接合温度提高到60℃或80℃对于缩短接合时间是有效的。研究了通过HF键合可以实现气密密封封装。

Integration and packaging technologies of sensors and circuits to realize wire-less bio-monitoring microsystems for human health care and sick prevention have been studied these two years.Fabrication of the ECG monitoring microsystem consists of three ECG detecting electrodes, an amplifierand transmitter, which can be set at the chest is one of the final goals of the project. Two types custom IC of transmitter of PWM and FM, and amplifier were designed and fabricated using the multi-chip IC service project of the Institute of Electric Engineering of Japan. The demodulation circuit using PLL for the relay transmitter set at the wrist was also designed and fabricated with the discrete circuits. It is going to be fabricated with custom IC.The FM type system showed better ECG signal quality but the PWM type system stands up the noise. The muiti-microsensor chip of pressure, temperature and pH sensing was fabricated for realizing micro capsule for the monitoring of the digestive tract. The micro chip was designed considering the packaging. The detection and PWM transmission circuit of pH sensor was also designed and fabricated with custom IC.In order to realize the micropackaging of the systems, low temperature SiO2-SiO2 bonding technology using diluted HF solution have been developed. The bonding was achieved at the room temperature but 24 hours is necessary before the bonding completed. Elevating the bonding temperature to 60ﾟC or 80ﾟC is effective to reduce the bonding time. It is investigated that the hermetic seal packaging can be realized by the HF bonding.