权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

Studies on Integration and Packaging Technologies for Health Information Monitoring Microsystems

健康信息监测微系统集成封装技术研究

基本信息

批准号：
09650491
负责人：
SHOJI Shuichi
金额：
$ 2.5万
依托单位：
Waseda University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1997
资助国家：
日本
起止时间：
1997 至 1998
项目状态：
已结题

项目摘要

Integration and packaging technologies of sensors and circuits to realize wire-less bio-monitoring microsystems for human health care and sick prevention have been studied these two years.Fabrication of the ECG monitoring microsystem consists of three ECG detecting electrodes, an amplifierand transmitter, which can be set at the chest is one of the final goals of the project. Two types custom IC of transmitter of PWM and FM, and amplifier were designed and fabricated using the multi-chip IC service project of the Institute of Electric Engineering of Japan. The demodulation circuit using PLL for the relay transmitter set at the wrist was also designed and fabricated with the discrete circuits. It is going to be fabricated with custom IC.The FM type system showed better ECG signal quality but the PWM type system stands up the noise. The muiti-microsensor chip of pressure, temperature and pH sensing was fabricated for realizing micro capsule for the monitoring of the digestive tract. The micro chip was designed considering the packaging. The detection and PWM transmission circuit of pH sensor was also designed and fabricated with custom IC.In order to realize the micropackaging of the systems, low temperature SiO2-SiO2 bonding technology using diluted HF solution have been developed. The bonding was achieved at the room temperature but 24 hours is necessary before the bonding completed. Elevating the bonding temperature to 60ﾟC or 80ﾟC is effective to reduce the bonding time. It is investigated that the hermetic seal packaging can be realized by the HF bonding.

近两年来，本课题研究了传感器和电路的集成和封装技术，以实现人体保健和疾病预防的无线生物监测微系统，研制由三个心电检测电极、一个放大器和一个发射器组成的可放置在胸部的心电监测微系统是本课题的最终目标之一。利用日本电机研究所的多芯片集成电路服务项目，设计并制作了PWM和FM两种发射机和放大器的定制集成电路。采用分立电路设计并制作了用于手腕中继发射机的锁相环解调电路。FM型系统显示出更好的ECG信号质量，但PWM型系统经受住了噪声。为实现微胶囊消化道监测，研制了压力、温度和pH传感器芯片。微芯片的设计考虑到封装。设计了pH传感器的检测电路和PWM传输电路，并采用定制IC进行了制作。为了实现系统的微封装，采用了稀HF溶液低温SiO2-SiO2键合技术。在室温下实现结合，但在结合完成之前需要24小时。将接合温度提高到60 ° C或80 ° C可有效缩短接合时间。研究了采用高频键合技术实现密封封装的可行性。