Transmission electron microscope observation of cracks introduced in bulk crystals

透射电子显微镜观察块状晶体中引入的裂纹

• 批准号: 10305045
• 负责人: SAKA Hiroyasu
• 金额: $ 24.13万
• 依托单位: Nagoya University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (A).
• 财政年份: 1998
• 资助国家: 日本
• 起止时间: 1998 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-10305045/
• 关键词: Crack; Transmission electron microscopy; dislocations; bulk crystals; focused ion beam technique; 破壊; DBTT; TEM; FIB

Fracture of materials is one of the most important subjects in materials science. There are two approaches to the study of fracture of materials. One is macroscopic one and the other is atomistic simulation using a computer. However, there is a big gap between these extremes and it is information on mesoscopic scale that bridges this gap. In order to get such information on mesoscopic scale transmission electron microscopy should be the most appropriate technique. However, it is extremely difficult to prepare a foil specimen which contain S the very tip of a crack.The purpose of the present study is to examine by transmission electron microscopy those cracks which were introduced in bulk crystals applying a focused ion beam technique to preparation of a thin foil specimen from pre-selected area such as a crack tip. This contributes much to bridge the gap between macroscopic approach and atomistic simulation. In this study, Si, GaAs, alumina and quasicrystals were used as specimens and the defect structures at and near the tips of the cracks were observed comprehensively.

材料断裂是材料科学中的重要课题之一。研究材料断裂有两种方法。一个是宏观的一个，另一个是原子模拟使用计算机。然而，这两个极端之间存在着巨大的差距，而中观尺度上的信息弥合了这一差距。为了得到这样的信息在介观尺度上的透射电子显微镜应该是最合适的技术。然而，这是非常困难的，以准备一个箔试样，其中包含S的裂纹的最尖端，本研究的目的是通过透射电子显微镜检查这些裂纹被引入到散装晶体应用聚焦离子束技术，从预先选定的区域，如裂纹尖端的薄箔试样的制备。这有助于弥合宏观方法和原子模拟之间的差距。本文以Si、GaAs、Al2O3和准晶为材料，对裂纹尖端及其附近的缺陷结构进行了全面的观察。

项目成果

M.Wollgarten,H.Saka and A.Inoue: "Microstructural investigotion of the brittle-to-ductile transition in Si-Pd-Mn quasi crystals"Phil.Mag.A. 79.9. 2195-2208 (1999)

M.Wollgarten、H.Saka 和 A.Inoue：“Si-Pd-Mn 准晶体中脆性到韧性转变的微观结构研究”Phil.Mag.A。

Suprijadi and H.Saka: "Cross-sectional and plan-view observation of cracks introduced in Si at the ductile-brittle transition temperature"Mat.Res.Soc.Symp.Proc.. 538. 169-174 (1999)

Suprijadi 和 H.Saka：“在延性-脆性转变温度下 Si 中引入的裂纹的横截面和平面图观察”Mat.Res.Soc.Symp.Proc.. 538. 169-174 (1999)

Suprijadi, and H.Saka: "TEM observation of dislocation emission from a crack at DBTT in Si"Materi.Trans.. 42. 28-32 (2001)

Suprijadi 和 H.Saka：“Si 中 DBTT 裂纹位错发射的 TEM 观察”Materi.Trans.. 42. 28-32 (2001)

H.Saka,J.Shimatani,Suprijadi and T.Nango: "FIB/TEM observation of defect structure underneath an indentation in silicon"Mat.Res.Soc.Symp.Proc.. 522. 71-76 (1998)

H.Saka、J.Shimatani、Suprijadi 和 T.Nango：“硅压痕下缺陷结构的 FIB/TEM 观察”Mat.Res.Soc.Symp.Proc.. 522. 71-76 (1998)

H.Saka,J.Shimatani,Suprijadi and T.Nango: "FIB/TEM observation of defect structure underneath an indentation in silicon "Mat,Res,Soc.Symp.Proc.. 522. 71-76 (1998)

H.Saka、J.Shimatani、Suprijadi 和 T.Nango：“硅压痕下缺陷结构的 FIB/TEM 观察”Mat,Res,Soc.Symp.Proc.. 522. 71-76 (1998)