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Establishment of a new method of evaluation for the adhesive strength of thin films by micro-indentation wit two degrees of freedom

二自由度微压痕评价薄膜粘合强度新方法的建立

基本信息

批准号：
10555024
负责人：
KAMIYA Shoji
金额：
$ 3.71万
依托单位：
TOHOKU UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
1998
资助国家：
日本
起止时间：
1998 至 1999
项目状态：
已结题

项目摘要

This research project aims at the establishment of a new method of evaluation for the adhesive strength of thin films by micro-indentation with two degrees of freedom. We studied the following three points and have succeeded to developed a method which can be generally applicable to various combinations of films and substrates.Trial production of two-freedom indentorA micro-indentation set-up with two degrees of freedom was developed. This is equipped with an optical microscope which enables real-time observation of crack extension behavior for the measurement of interface crack length.Selection of the optimum loading path and shape of indentorVarious loading, configurations were examined by using the indentor developed above. As a conclusion, specimens should be prepared where the film is projected a little out of the cross section of the substrate. This projection is pushed upwards from the interface side by a conical stylus of diamond, which we found the best way to efficiently extend an interface crack.Evaluation of toughness by the computational simulationComputational simulations were carried out according to the loading configuration above. By comparing the crack extension resistance curves obtained by both experiment and simulation, we succeeded to evaluate the toughness of interface. As an example, the toughness of interface between a WC-Co substrate and the diamond film prepared as a wear protection coating was determined to be about 14 J/mィイD12ィエD1. Although adhesion of wear protection coating is one of the critical problems, this is the first quantitative data ever obtained all over the world for the adhesive strength of diamond coatings on WC-Co cutting tools. This fact proves that our new method is quite a successful one with a significant advantage for industries.

本研究旨在建立一种新的薄膜结合强度的二自由度微压痕评价方法。我们研究了以下三个问题，并成功地发展了一种能普遍适用于各种薄膜和基片组合的方法。二自由度压痕仪的试制开发了一种二自由度微压痕装置。该仪器配备有光学显微镜，可以实时观察裂纹扩展行为，用于测量界面裂纹长度。最佳加载路径和压头形状的选择使用上述开发的压头对各种加载配置进行了检查。作为结论，应制备样品，其中膜从基底的横截面突出一点。该投影由金刚石的锥形触针从界面侧向上推动，我们发现这是有效扩展界面裂纹的最佳方式。通过计算模拟评估韧性根据上述加载配置进行了计算模拟。通过对比实验和模拟得到的裂纹扩展阻力曲线，成功地评价了界面的韧性。作为一个例子，WC-Co基体和作为磨损保护涂层制备的金刚石膜之间的界面韧性被确定为约14 J/m Ω D12 Ω D1。虽然耐磨涂层的结合力是关键问题之一，但这是迄今为止世界上首次获得的WC-Co刀具上金刚石涂层结合力的定量数据。这一事实证明，我们的新方法是相当成功的，具有显着的优势，为工业。