Study for adhesion analysis of resist pattern of 0.1μm line-width by using atomic force microscope tip

原子力显微镜针尖对0.1μm线宽光刻胶图形附着力分析研究

• 批准号: 10650332
• 负责人: KAWAI Akira
• 金额: $ 2.05万
• 依托单位: Nagaoka University of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1998
• 资助国家: 日本
• 起止时间: 1998 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-10650332/
• 关键词: Adhesion; Integrated Circuit of Semiconductor; Atomic force microscope; Resist; Surface energy; Finite element method; Lithography; Solid Surface; 光リソグラフィー; フォトレジストパターン; 有限要素法; 摩擦力; 凝集破壊; ファンデルワールスカ

In the 21^<st> century, micro and nanofabrication technique has become important to realize electronic micro devices such as high density memory and liquid crystal display. In the lithography process, particularly, photoresist is regarded as an important mask material for dry or wet etching processes. However, improvement of the adhesion strength of the resist micropattern has been recognized as one serious problem to be solved, because the pattern collapse during water rinsing in the pattern development process occurs drastically due to Laplace force. In these days, various studies on adhesive phenomena of photoresist material have been accomplished by several researchers. A great deal of effort has been made on monitoring the adhesive property. What seems to be lacking, however, is quantitative and direct analysis physically. Meanwhile, with the invention of the atomic force microscope (AFM), we have been equipped in good time with the appropriate tools to understand the physical pro … More perties of condensed matter on a nanometer scale. As mentioned above, with the increasing degree of miniaturization in microelectronics, we unquestionably become confronted with structures of matter on a scale below 100 nm. In this regard, the investigator has already proposed the novel principle for direct analysis method for resist pattern adhesion, that is, direct peeling with the AFM tip (DPAT). In this study, by this method, the dependency of the load for collapse of the resist micropattern on heating temperature and linewidth are shown. Understanding these collapse property is of crucial importance for development not only microelectronic device but device in nanometer scale. Moreover, collapse and fracture mechanism of the resist line-pattern of 100 nm width formed by the KrF-excimer laser lithography are characterized by the DPAT method. Particularly, loading position dependency of pattern collapse and fracture mechanism are mainly focused. The DPAT method in this study can be applied to an ArF resist pattern, electron beam and synchrotron radiation resist patterns less than 70nm in width. Moreover, this technique will give useful information to other fields, for example, condensation control of micro particles and structural design for micro machine and so on. Less

进入21^<st>世纪，微纳加工技术已成为实现高密度存储器、液晶显示器等电子微器件的重要手段。特别是在光刻工艺中，光致抗蚀剂被认为是用于干法或湿法蚀刻工艺的重要掩模材料。然而，抗蚀剂微图案的粘附强度的提高已被认为是一个有待解决的严重问题，因为在图案显影工艺中的水冲洗期间，由于拉普拉斯力而急剧发生图案塌陷。近年来，许多研究者对光致抗蚀剂材料的粘附现象进行了各种研究。在监测粘合剂性能方面已经做了大量的努力。然而，似乎缺乏的是定量和直接的物理分析。与此同时，随着原子力显微镜（AFM）的发明，我们已经配备了适当的工具来了解物理过程的好时机。 ...更多信息 在纳米尺度上的凝聚态性质。如上所述，随着微电子技术小型化程度的提高，我们无疑会面临100 nm以下的物质结构。在这方面，研究人员已经提出了新的原则，直接分析方法的抗蚀剂图案的粘附，即直接剥离与AFM针尖（DPAT）。在这项研究中，通过这种方法，抗蚀剂微图案的崩溃的负载的依赖性上的加热温度和线宽。了解这些塌陷特性对微电子器件乃至纳米尺度器件的发展都具有重要意义。此外，崩溃和断裂机制的抗蚀剂线图案的宽度为100 nm的KrF-准分子激光光刻形成的DPAT方法的特点。重点研究了模型坍塌的加载位置依赖性和断裂机理。本研究中的DPAT方法可应用于宽度小于70 nm的ArF抗蚀剂图案、电子束和同步辐射抗蚀剂图案。此外，该技术还将为其他领域提供有用的信息，如微颗粒的冷凝控制和微机械的结构设计等。

项目成果

Akira Kawai,Kiyoshi Shimada and Eiichi Andoh.: "Dependency of Micro Particle Adhesion of Dispersive and Nondispersive Interactions Analyzed by Atomic Force Microscopy"Solid State Phenomena. 65. 191-194 (1999)

Akira Kawai、Kiyoshi Shimada 和 Eiichi Andoh.：“原子力显微镜分析的分散和非分散相互作用的微粒粘附依赖性”固态现象。

Akira Kawai, Norio Moriike: "Adhesion and Cohesion Analysis of ArF/SOR Resist Patterns with Microtip of Atomic Force Microscope (AFM)"J.Photopolymer Science. and Technology. 14(in press). (2001)

Akira Kawai、Norio Moriike：“利用原子力显微镜 (AFM) 微尖对 ArF/SOR 抗蚀剂图案进行粘附和内聚分析”J.Photopolymer Science。

Akira Kawai: "Adhesion analysis of Micro Condensed Material by Atomic Force Microscope"Adhesion. 44. 16-25 (2000)

Akira Kawai：“原子力显微镜对微凝聚态材料的粘附力分析”粘附力。

A.Kawai,K.Shimada, E.Andoh: "Dependency of Micro Particle Adhesion of Dispersive and Nondispersive Interactions Analyzed by Atomic Force Microscopy"Solid State Phenomena. 65〜66. 191-194 (1999)

A.Kawai、K.Shimada、E.Andoh：“通过原子力显微镜分析的分散和非分散相互作用的微粒粘附依赖性”固态现象 65-66 (1999)。

河合 晃: "原子力顕微鏡による表面特性の解析"日本接着学会誌. 36(2)(印刷中). (2000)

Akira Kawai：“使用原子力显微镜分析表面特性”日本粘合协会杂志 36(2)（印刷中）。