Adhesion and cohesion analysis of resist micro patterns less than 100nm by using atomic force microscope

利用原子力显微镜分析小于100nm抗蚀剂微图案的附着力和内聚力

• 批准号: 13650373
• 负责人: KAWAI Akira
• 金额: $ 2.05万
• 依托单位: Nagaoka University of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2003
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650373/
• 关键词: adhesion; integration circuit; atomic force microscope; resist; surface energy; finite element method; lithography; solid surface; 付着力; 高分子集合体

In recent years, adhesion and condensation control of minute resist pattern less than 100nm size has become important to realize high quality integrated circuit devices. In these days, various analysis of nature of micro resist patterns have been accomplished. In this study present investigator has already proposed the novel principle for direct analysis method for resist micro pattern, that is, direct peeling method by using atomic force microscope(ARM) tip. (DPAT method) By the DPAT method, quantitative analysis of cohesive properties of various type resist pattern has been accomplished. Particularly, the granular property of polymer aggregate less than 100nm is discussed and the condensation model of polymer aggregate accompanying with vacancy is introduced. The condensation of polymer aggregate of approximately 5Onm size is clearly observed in the resist surface. By the separation technique, the cohesive property of condensed polymer aggregate is analyzed. It is clearly indicated that the two condensed polymer aggregates are separated into 13 pieces of aggregates. The interaction force of polymer aggregates can be analyzed based on Derjaguin approximation. By the tip indentation method, the condensation of polymer aggregate accompanying a certain vacancy can be analyzed. The polymer aggregate of 20nm size can be manipulated and rearranged in linear position. One can safely state that the polymer aggregate is regarded as a granular solid material which has a certain cohesive strength. The condensation model of polymer aggregate accompany with vacancy is introduced. In these study, the publication of 36 Journal papers of and the 40 presentations at the conference have been conducted.

近年来，尺寸小于100nm的微小抗蚀剂图案的粘附和凝结控制对于实现高质量集成电路器件变得重要。如今，已经完成了对微抗蚀剂图案性质的各种分析。在这项研究中，本研究人员已经提出了抗蚀剂微图案直接分析方法的新原理，即使用原子力显微镜（ARM）尖端的直接剥离方法。 (DPAT法) 通过DPAT法，完成了各种类型抗蚀剂图案的粘合特性的定量分析。特别讨论了小于100nm的聚合物聚集体的颗粒性质，并介绍了伴随空位的聚合物聚集体的缩合模型。在抗蚀剂表面清楚地观察到约50nm尺寸的聚合物聚集体的缩合。通过分离技术，分析了凝聚聚合物聚集体的粘结性能。清楚地表明，两个缩合聚合物聚集体被分成13块聚集体。聚合物聚集体的相互作用力可以基于Derjaguin近似来分析。通过尖端压痕法，可以分析伴随一定空位的聚合物聚集体的缩合。 20nm尺寸的聚合物聚集体可以被操纵并以线性位置重新排列。可以肯定地说，聚合物聚集体被视为一种具有一定内聚强度的粒状固体材料。介绍了含空位聚合物聚集体的缩合模型。在这些研究中，发表了 36 篇期刊论文和 40 场会议报告。

项目成果

原 朋敬, 小泉延恵, 河合 晃: "Glass/レジスト/Cu/Al/Glass多層構造の破壊特性解析"日本接着学会誌. 37. 303-308 (2001)

Tomoyuki Hara、Nobue Koizumi、Akira Kawai：“玻璃/抗蚀剂/Cu/Al/玻璃多层结构的断裂特性分析”日本粘合协会杂志 37. 303-308 (2001)。

磯部 亮, 河合 晃: "微細周期パターン上へのプラズマ重合膜の堆積特性"日本接着学会誌. 37. 433-436 (2001)

Ryo Isobe、Akira Kawai：“精细周期图案上等离子体聚合膜的沉积特性”日本粘合协会杂志 37. 433-436 (2001)。

Akira Kawai, Takato Abe: "Analysis of Pattern Collapse of Electron Beam Resist from 60 to 152 nm Width with Atomic Force Microscope Tip"J.Adhesion Soc.Japan. 38. 16-19 (2002)

Akira Kawai、Takato Abe：“使用原子力显微镜尖端分析 60 至 152 nm 宽度的电子束抗蚀剂图案塌陷”J.Adhesion Soc.Japan。

Akira Kawai, Daisuke Inoue: "Effect of Thermal Stress on Peel Property of Line Resist Pattern Analyzed by Atomic Force Microscope(AFM)"J.Adhes.Soc.Technol.. 39. 107-110 (2003)

Akira Kawai、Daisuke Inoue：“通过原子力显微镜 (AFM) 分析热应力对线抗蚀图案剥离特性的影响”J.Adhes.Soc.Technol.. 39. 107-110 (2003)

Akira Kawai: "Influence of moving speed of AFM tip on peeling strength of micro resist pattern"J.Adhes.Soc.Technol. 40. 11-13 (2004)

Akira Kawai：“AFM 尖端移动速度对微抗蚀剂图案剥离强度的影响”J.Adhes.Soc.Technol。