Adhesion and cohesion analysis of resist micro patterns less than 100nm by using atomic force microscope
Adhesion and cohesion analysis of resist micro patterns less than 100nm by using atomic force microscope
批准号:
13650373
负责人:
KAWAI Akira
金额:
$2.05万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2001
资助国家:
日本
项目状态:
已结题
起止时间:
2001 至 2003
中文摘要
近年来,控制小于100nm尺寸的微细阻图案的粘附和凝结已成为实现高质量集成电路器件的重要问题。近年来,人们对微阻图案的性质进行了各种各样的分析。在本研究中,研究者已经提出了一种新的抗蚀剂微观图案直接分析方法的原理,即原子力显微镜(ARM)尖端直接剥离法。(DPAT方法)采用DPAT方法,对不同类型抗蚀剂的粘结性能进行了定量分析。特别讨论了小于100nm的聚合体的颗粒特性,并介绍了伴随空位的聚合体缩聚模型。在抗蚀剂表面可以清楚地观察到约5Onm大小的聚合物聚集体的缩聚。通过分离技术,分析了聚合聚合体的粘结性能。结果清楚地表明,两个凝聚的聚合物聚集体被分离成13块聚集体。聚合物聚集体的相互作用力可以基于Derjaguin近似进行分析。利用尖端压痕法,可以分析聚合物聚集体存在一定空位时的缩聚现象。20nm大小的聚合物聚集体可以被操纵并在线性位置上重新排列。可以肯定地说,聚合物骨料是一种颗粒状的固体材料,具有一定的内聚强度。介绍了含空位的聚合物集料缩聚模型。在本研究中,共发表了36篇期刊论文和40篇会议报告。
英文摘要
In recent years, adhesion and condensation control of minute resist pattern less than 100nm size has become important to realize high quality integrated circuit devices. In these days, various analysis of nature of micro resist patterns have been accomplished. In this study present investigator has already proposed the novel principle for direct analysis method for resist micro pattern, that is, direct peeling method by using atomic force microscope(ARM) tip. (DPAT method) By the DPAT method, quantitative analysis of cohesive properties of various type resist pattern has been accomplished. Particularly, the granular property of polymer aggregate less than 100nm is discussed and the condensation model of polymer aggregate accompanying with vacancy is introduced. The condensation of polymer aggregate of approximately 5Onm size is clearly observed in the resist surface. By the separation technique, the cohesive property of condensed polymer aggregate is analyzed. It is clearly indicated that the two condensed polymer aggregates are separated into 13 pieces of aggregates. The interaction force of polymer aggregates can be analyzed based on Derjaguin approximation. By the tip indentation method, the condensation of polymer aggregate accompanying a certain vacancy can be analyzed. The polymer aggregate of 20nm size can be manipulated and rearranged in linear position. One can safely state that the polymer aggregate is regarded as a granular solid material which has a certain cohesive strength. The condensation model of polymer aggregate accompany with vacancy is introduced. In these study, the publication of 36 Journal papers of and the 40 presentations at the conference have been conducted.
期刊论文(94)
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科研奖励(0)
会议论文
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原 朋敬, 小泉延恵, 河合 晃: "Glass/レジスト/Cu/Al/Glass多層構造の破壊特性解析"日本接着学会誌. 37. 303-308 (2001)
Tomoyuki Hara、Nobue Koizumi、Akira Kawai:“玻璃/抗蚀剂/Cu/Al/玻璃多层结构的断裂特性分析”日本粘合协会杂志 37. 303-308 (2001)。
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磯部 亮, 河合 晃: "微細周期パターン上へのプラズマ重合膜の堆積特性"日本接着学会誌. 37. 433-436 (2001)
Ryo Isobe、Akira Kawai:“精细周期图案上等离子体聚合膜的沉积特性”日本粘合协会杂志 37. 433-436 (2001)。
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Akira Kawai, Takato Abe: "Analysis of Pattern Collapse of Electron Beam Resist from 60 to 152 nm Width with Atomic Force Microscope Tip"J.Adhesion Soc.Japan. 38. 16-19 (2002)
Akira Kawai、Takato Abe:“使用原子力显微镜尖端分析 60 至 152 nm 宽度的电子束抗蚀剂图案塌陷”J.Adhesion Soc.Japan。
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Akira Kawai, Daisuke Inoue: "Effect of Thermal Stress on Peel Property of Line Resist Pattern Analyzed by Atomic Force Microscope(AFM)"J.Adhes.Soc.Technol.. 39. 107-110 (2003)
Akira Kawai、Daisuke Inoue:“通过原子力显微镜 (AFM) 分析热应力对线抗蚀图案剥离特性的影响”J.Adhes.Soc.Technol.. 39. 107-110 (2003)
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Akira Kawai: "Influence of moving speed of AFM tip on peeling strength of micro resist pattern"J.Adhes.Soc.Technol. 40. 11-13 (2004)
Akira Kawai:“AFM 尖端移动速度对微抗蚀剂图案剥离强度的影响”J.Adhes.Soc.Technol。
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