Adhesion and cohesion analysis of resist micro patterns less than 100nm by using atomic force microscope

利用原子力显微镜分析小于100nm抗蚀剂微图案的附着力和内聚力

• 批准号: 13650373
• 负责人: KAWAI Akira
• 金额: $ 2.05万
• 依托单位: Nagaoka University of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2003
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650373/
• 关键词: adhesion; integration circuit; atomic force microscope; resist; surface energy; finite element method; lithography; solid surface; 付着力; 高分子集合体

In recent years, adhesion and condensation control of minute resist pattern less than 100nm size has become important to realize high quality integrated circuit devices. In these days, various analysis of nature of micro resist patterns have been accomplished. In this study present investigator has already proposed the novel principle for direct analysis method for resist micro pattern, that is, direct peeling method by using atomic force microscope(ARM) tip. (DPAT method) By the DPAT method, quantitative analysis of cohesive properties of various type resist pattern has been accomplished. Particularly, the granular property of polymer aggregate less than 100nm is discussed and the condensation model of polymer aggregate accompanying with vacancy is introduced. The condensation of polymer aggregate of approximately 5Onm size is clearly observed in the resist surface. By the separation technique, the cohesive property of condensed polymer aggregate is analyzed. It is clearly indicated that the two condensed polymer aggregates are separated into 13 pieces of aggregates. The interaction force of polymer aggregates can be analyzed based on Derjaguin approximation. By the tip indentation method, the condensation of polymer aggregate accompanying a certain vacancy can be analyzed. The polymer aggregate of 20nm size can be manipulated and rearranged in linear position. One can safely state that the polymer aggregate is regarded as a granular solid material which has a certain cohesive strength. The condensation model of polymer aggregate accompany with vacancy is introduced. In these study, the publication of 36 Journal papers of and the 40 presentations at the conference have been conducted.

近年来，对尺寸小于100 nm的微小抗蚀剂图形的粘合和凝聚控制已成为实现高质量集成电路器件的重要手段。在这些日子里，已经完成了对微抗蚀剂图案性质的各种分析。在本研究中，研究人员已经提出了抗蚀剂微图形直接分析的新原理，即利用原子力显微镜(ARM)针尖的直接剥离法。(DPAT方法)利用DPAT方法，对各种类型的抗蚀剂图形的内聚性进行了定量分析。特别讨论了小于100 nm的聚集体的颗粒特性，并介绍了伴随空位的聚集体凝聚模型。在抗蚀剂表面可以清楚地观察到尺寸约为50 nm的聚合物聚集体的凝聚。利用分离技术，分析了凝聚聚合物骨料的粘结性能。结果表明，这两个凝聚聚合物聚集体被分成13个聚集体。聚合物聚集体之间的相互作用力可以基于德尔贾金近似进行分析。用尖端压痕法可以分析伴随一定空位的聚合物聚集体的凝聚过程。粒径为20 nm的聚合物聚集体可以在线性位置进行操纵和重排。可以肯定地说，聚合物集料被视为具有一定粘聚力的颗粒状固体材料。介绍了聚合物聚集体伴随空位的凝聚模型。在这些研究中，发表了36篇期刊论文，并在会议上发表了40篇演讲。

项目成果

原 朋敬, 小泉延恵, 河合 晃: "Glass/レジスト/Cu/Al/Glass多層構造の破壊特性解析"日本接着学会誌. 37. 303-308 (2001)

Tomoyuki Hara、Nobue Koizumi、Akira Kawai：“玻璃/抗蚀剂/Cu/Al/玻璃多层结构的断裂特性分析”日本粘合协会杂志 37. 303-308 (2001)。

磯部 亮, 河合 晃: "微細周期パターン上へのプラズマ重合膜の堆積特性"日本接着学会誌. 37. 433-436 (2001)

Ryo Isobe、Akira Kawai：“精细周期图案上等离子体聚合膜的沉积特性”日本粘合协会杂志 37. 433-436 (2001)。

Akira Kawai, Takato Abe: "Analysis of Pattern Collapse of Electron Beam Resist from 60 to 152 nm Width with Atomic Force Microscope Tip"J.Adhesion Soc.Japan. 38. 16-19 (2002)

Akira Kawai、Takato Abe：“使用原子力显微镜尖端分析 60 至 152 nm 宽度的电子束抗蚀剂图案塌陷”J.Adhesion Soc.Japan。

Akira Kawai, Daisuke Inoue: "Effect of Thermal Stress on Peel Property of Line Resist Pattern Analyzed by Atomic Force Microscope(AFM)"J.Adhes.Soc.Technol.. 39. 107-110 (2003)

Akira Kawai、Daisuke Inoue：“通过原子力显微镜 (AFM) 分析热应力对线抗蚀图案剥离特性的影响”J.Adhes.Soc.Technol.. 39. 107-110 (2003)

Akira Kawai: "Influence of moving speed of AFM tip on peeling strength of micro resist pattern"J.Adhes.Soc.Technol. 40. 11-13 (2004)

Akira Kawai：“AFM 尖端移动速度对微抗蚀剂图案剥离强度的影响”J.Adhes.Soc.Technol。