Basic Research on Non-equillibrium Microstructures of Sputter-deposited TiNi-base Shape Memory Alloy Thin Films

溅射沉积TiNi基形状记忆合金薄膜非平衡微结构的基础研究

• 批准号: 11305043
• 负责人: MIYAZAKI Shuichi
• 金额: $ 25.93万
• 依托单位: University of Tsukuba
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (A)
• 财政年份: 1999
• 资助国家: 日本
• 起止时间: 1999 至 2001
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-11305043/
• 关键词: Ti-Ni; Ti-Ni-Cu; Ti-Ni-Pd; shape memory alloy; microactuator; thin film; sputter-deposition; martensitic transformation; 非平衡細織; 薄膜; スパッタ法; 非平衡相; マイクロマシン; 非平衡組織

TiNi-base shape memory alloy thin films including Ti-Ni, Ti-Ni-Cu and Ti-Ni-Pd with various alloy compositions have been made by a r. f. magnetron sputtering method. The purpose of the present research is to investigate non-quillibrium microstructures which are characteristic for the thin films. It is expected that the addition of Cu to Ti-Ni is effective to decrease transformation temperature hysteresis, while that of Pd is effective to increase the transformation temperatures. Both the narrow temperature hysteresis and high temperature of the martensitic transformation are expected to be effective to increase the cyclic response of actuation.It is clarified that fine metastable plate precipitates were formed on {100}B2 planes when heat-treated around the crystallization temperature and were effective to achieve stable shape memory behavior, because the critical stress for slip deformation was increased by the precipitation hardening mechanism. The plate precipitates were changed to Ti2Ni equillibrium phase precipitates by increasing heat-treatment temperature, resulting in degradation of the shape memory characteristics. Similar metastable microstructures were also observed both in Ti-Ni-Cu and Ti-Ni-Pd thin films and were effective to achieve stable shape memory behavior. The transformation temperature hysteresis was changed down to about one third of that of Ti-Ni by adding Cu more than 10at%, while the martensitic transformation temperature was increased up to 562K by adding 22at%Pd to the Ti-Ni.

已制备出各种合金成分的TiNi基形状记忆合金薄膜，包括Ti-Ni、Ti-Ni-Cu和Ti-Ni-Pd。 f.磁控溅射法。本研究的目的是研究薄膜特有的非平衡微观结构。预计Ti-Ni中添加Cu可有效降低相变温度滞后，而Pd可有效提高相变温度。窄的温度滞后和马氏体转变的高温都有望有效地增加驱动的循环响应。研究表明，当在结晶温度附近进行热处理时，在{100}B2平面上形成细小的亚稳板状析出物，并且可以有效地实现稳定的形状记忆行为，因为沉淀硬化机制增加了滑移变形的临界应力。通过提高热处理温度，板状析出物转变为Ti2Ni平衡相析出物，导致形状记忆特性下降。在 Ti-Ni-Cu 和 Ti-Ni-Pd 薄膜中也观察到类似的亚稳态微观结构，并且可有效实现稳定的形状记忆行为。通过在Ti-Ni中添加超过10at%的Cu，转变温度滞后变化降至Ti-Ni的约三分之一，而通过在Ti-Ni中添加22at%Pd，马氏体转变温度提高至562K。

项目成果

M.Kohl, E.Just, E.Quandt, B.Winzek, S.Miyazaki, D.M.Allen: "Shape Memory Microvalves Based on Rolled Sheets or Thin Films"Materials Science and Engineering. A273-275. 784-788 (1999)

M.Kohl、E.Just、E.Quandt、B.Winzek、S.Miyazaki、D.M.Allen：“基于卷状板材或薄膜的形状记忆微阀”材料科学与工程。

J.Sakurai, H.Hosoda, S.Kajiwara, S.Miyazaki: "Nanoscale Microstructure Formed During Crystallization and Shape Memory Behavior in Sputter-Deposited Ti-rich Ti-Ni Thin Films"Trans. Mater. Res. Soc. Japan. 25. 801-804 (2000)

J.Sakurai、H.Hosoda、S.Kajiwara、S.Miyazaki：“溅射沉积富钛钛镍薄膜中结晶过程中形成的纳米级微观结构和形状记忆行为”Trans。

T.Kikuchi, K.Ogawa, S.Kajiwara, T.Matsunaga, S.Miyazaki: "Further Studies on Nonequilibrium Phase and Nanocrystals Formed During Crystallization of Amorphous Ti-rion Ti-Ni Thin Films"Proc. of PTM-99. 1092-1095 (1999)

T.Kikuchi、K.Okawa、S.Kajiwara、T.Matsunaga、S.Miyazaki：“非晶钛离子钛镍薄膜结晶过程中非平衡相和纳米晶体形成的进一步研究”Proc。

H.Hosoda, S.Miyazaki, S.Hanada: "Potential of IrAl Base Alloys As Ulatrahigh-Temperature Smart Coatings"Intermetallics. 8. 1081-1090 (2000)

H.Hosoda、S.Miyazaki、S.Hanada：“IrAl 基合金作为超高温智能涂层的潜力”金属间化合物。

細田秀樹, 宮崎修一: "生体用形状記憶合金の開発の現状"BOUBNDARY. 9月号. 37-41 (2000)

Hideki Hosoda，Shuichi Miyazaki：“生物用途形状记忆合金的开发现状”BOUBNDARY 9 月号（2000 年）。