Advanced Assessment Methodology of Lead-free Solder Joints under Multi-loads in Three-dimensional Electronic Packaging

三维电子封装多负载下无铅焊点先进评估方法

• 批准号: 18360056
• 负责人: YU Qiang
• 金额: $ 10.14万
• 依托单位: Yokohama National University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2006
• 资助国家: 日本
• 起止时间: 2006 至 2007
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-18360056/
• 关键词: 3D-Packaging Technology; Solder Joints; Multi-axial stresses; Low-cycle fatigue; Creep; Fatigue Life; Finite Element Method; Strain Measurement; 電子デバイス; 熱サイクル疲労; マルチ破壊モード; 界面破壊; 弾塑性クリープ

This paper reports a fundamental methodology of the assessment for thermal fatigue reliability of lead-free solder joints in three-dimensional electronic packaging. In particular, multi-loads condition provides complex failure mechanism to the assessment of reliability. Nanoindentation tests were carried out for lead or lead-free solder balls to evaluate mechanical properties under multi-axial stresses. Ratchet and transition of creep mechanism were found during the indentation creep. In the case of thin film such as plating finishes, mechanical properties may change due to multi-axial stresses. Based on measured properties, tin whisker initiation was examined. Transition from power-law creep to diffusion creep accelerates atoms migrating rate and then tin whiskers initiate due to the accumulation of atoms at the localized area. Another discussion is the reliability of connectors under multi loads. Three point bending tests were performed to evaluate the low-cycle fatigue under multi-loads. Inelastic strain range, which is the key to fatigue life of solder joints, increases with the multi loads. Finally, a methodology to assess the fatigue life of connectors under multi loads was developed.

本文报告了三维电子包装中无铅焊接接头的热疲劳可靠性评估的基本方法。特别是，多载条件为可靠性评估提供了复杂的故障机制。对纳米引导测试进行了无铅或无铅焊球，以评估多轴应力下的机械性能。在压痕蠕变期间发现了棘轮和蠕变机制的过渡。在薄膜（例如电镀饰面）的情况下，机械性能可能会因多轴应力而改变。基于测量的特性，检查了锡晶须的启动。从幂律爬行到扩散蠕变的过渡，由于原子在局部区域的积累而启动的锡晶须迁移。另一个讨论是连接器在多负载下的可靠性。进行了三个弯曲测试，以评估多载下的低周期疲劳。非弹性应变范围是焊接接头疲劳寿命的关键，随着多载荷的增加而增加。最后，开发了一种评估多负载下连接器疲劳寿命的方法。

项目成果

Modeling with Structure of Resins in Electronic Components

电子元件树脂结构建模

• 发表时间: 2006
• 期刊: Proceedings of THERMINIC2006
• 作者: Yu;Q
• 通讯作者: Q

Tri-state multi-contact lateral MEMS relay with high mechanical reliability

具有高机械可靠性的三态多触点横向 MEMS 继电器

• 发表时间: 2006
• 期刊: Proceedings of EMAP2006
• 作者: Yamada;S.
• 通讯作者: S.

Effective Acquisitions of Plastic, Creep, Viscoplastic Parameters of Solder Using the Stress Relaxation Method

利用应力松弛法有效获取焊料的塑性、蠕变、粘塑性参数

• 发表时间: 2006
• 期刊: Proceedings of EMAP2006
• 作者: Tanimura;T.
• 通讯作者: T.

Study on Whisker Outbreak on Tin Plating by Contact Force

接触力镀锡晶须爆发的研究

• 发表时间: 2006
• 期刊: Proceedings of ASME IMECE2006
• 作者: Yamashita;T.
• 通讯作者: T.

A study of deformation mechanism during nanoindentation creep in tin-based solder balls

• DOI: 10.1115/1.2429712
• 发表时间: 2007-03
• 期刊: Journal of Electronic Packaging
• 影响因子: 1.6
• 作者: T. Shibutani;Qiang Yu;M. Shiratori