Integrated Reliability Evaluation and Design for Advanced 3D Electronics Packaging

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It is forecast that high-density packaging, including 3D packaging, will become a main surface mount technology because of a need in the high-frequency areas of high-speed signal transmission. In the 3D packaging technology, an integrated design that unites the technology of semiconductor design, substrate design and equipment design is necessary. In addition, it is necessary to shorten the development time by completing the design at an early design stage in order to dominate technological competition. Additionally, due to the environmental problems associated with lead, the movement to establish regulations for the removal of lead and the use of lead-free solder material to replace Sn-Pb solder are growing rapidly now. With such new 3D packaging technology and design concepts, the reliability assessment and establishment of design techniques are very important factors.In this paper, reliability assessment and design problems, which must be solved before lead-free solder can be used in practical applications, are examined using analytical and experimental methods. Through this study, reliability assessment and design problems, which have become very important in practical applications of lead-free solder, are shown, and solutions for these problems are proposed. As a result of this study, it is possible to improve the reliability of lead-free solder joints and the efficiency of reliability assessments as well as to reduce production costs by shortening the design period.