Integrated Reliability Evaluation and Design for Advanced 3D Electronics Packaging

据预测，由于在高速信号传输的高频领域中的需要，包括3D封装的高密度封装将成为主要的表面安装技术。在3D封装技术中，需要将半导体设计、基板设计和设备设计的技术统一起来的集成设计。此外，有必要通过在早期设计阶段完成设计来缩短开发时间，以便在技术竞争中占据主导地位。此外，由于与铅相关的环境问题，现在建立用于去除铅的法规和使用无铅焊料材料来代替Sn-Pb焊料的运动正在迅速发展。在这种新的3D封装技术和设计理念下，可靠性评估和设计技术的建立是非常重要的因素，本文采用分析和实验的方法，研究了无铅焊料在实际应用之前必须解决的可靠性评估和设计问题。通过这项研究，可靠性评估和设计问题，这已成为非常重要的无铅焊料的实际应用中，显示，并提出解决这些问题的方法。作为本研究的结果，有可能提高无铅焊点的可靠性和可靠性评估的效率，以及通过缩短设计周期来降低生产成本。

It is forecast that high-density packaging, including 3D packaging, will become a main surface mount technology because of a need in the high-frequency areas of high-speed signal transmission. In the 3D packaging technology, an integrated design that unites the technology of semiconductor design, substrate design and equipment design is necessary. In addition, it is necessary to shorten the development time by completing the design at an early design stage in order to dominate technological competition. Additionally, due to the environmental problems associated with lead, the movement to establish regulations for the removal of lead and the use of lead-free solder material to replace Sn-Pb solder are growing rapidly now. With such new 3D packaging technology and design concepts, the reliability assessment and establishment of design techniques are very important factors.In this paper, reliability assessment and design problems, which must be solved before lead-free solder can be used in practical applications, are examined using analytical and experimental methods. Through this study, reliability assessment and design problems, which have become very important in practical applications of lead-free solder, are shown, and solutions for these problems are proposed. As a result of this study, it is possible to improve the reliability of lead-free solder joints and the efficiency of reliability assessments as well as to reduce production costs by shortening the design period.