Development Study on Ultra Precision Lapping Technique of Large Sized Workpiece by Oscillation Controlled Method

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This study aims to develop and propose an oscillation controlled lapping method, which uses a small diameter lap tool and is classed in the single wafer lapping system, as an effective method to achieve high precision controlled lapping of large sized workpiece. As the results, it is clear that the relations among the slurry flow, pressure distribution with tool overhanging and lapping characteristics of the proposed method based on a series of experiments and theoretical results using finite element analysis. Moreover, it is founded that the slurry flow mechanism is changed greatly with an offset between the tool and the workpiece. Furthermore, the controlled lapping within under 1um is achieved by the proposed method