Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-Assembly

研究了实现3D叠层光电子系统芯片(SOC)的关键技术，重点研究了实现高对准精度3D叠层的新图形组装技术和新的3D硅光子学。我们在硅芯片的上下表面形成微/纳米尺度的凹凸图案，然后利用气体组装中液体的表面张力将这些芯片精确对准。利用气孔组件，获得了小于0.1um的高对准精度。我们已经开发了TSPV(通过硅光子通孔)和UDOC(单向光耦合器)的新技术。我们成功地制作了直径为10um的TSPV，表现出良好的光学限制性能。提出并制作了一种新型的带侧镜的光纤光栅耦合器。我们证实了利用这种光纤光栅耦合器将TSPV中传输的垂直光信号耦合到水平硅纳米光波导上，耦合效率达到80%以上。

Key technologies to achieve a 3D-stacked optoelectronic system-on-a chip (SOC) have been studied focusing on new grapho-assembly technology to achieve 3D stacking with high alignment accuracy and new 3D silicon photonics. We formed micro/nano-scale concavo-convex patterns on both upper and lower silicon chip surfaces and then these chips were precisely aligned making use of surface tension of liquid in the gapho-assembly. A high alignment accuracy of less than 0.1um has been achieved using the gapho-assembly. We have developed new technologies of TSPV (Through Si Photonic Via) and UDOC (Uni-Directional Optical Coupler). We successfully fabricated TSPV with a diameter of 10um showing excellent optical confinement. We proposed and fabricated a new optical grating coupler with side mirror. We confirmed that vertical optical signal propagated through TSPV was coupled to horizontal Si nano optical waveguide using this optical grating coupler with high coupling efficiency of more than 80%.