Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-Assembly

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Key technologies to achieve a 3D-stacked optoelectronic system-on-a chip (SOC) have been studied focusing on new grapho-assembly technology to achieve 3D stacking with high alignment accuracy and new 3D silicon photonics. We formed micro/nano-scale concavo-convex patterns on both upper and lower silicon chip surfaces and then these chips were precisely aligned making use of surface tension of liquid in the gapho-assembly. A high alignment accuracy of less than 0.1um has been achieved using the gapho-assembly. We have developed new technologies of TSPV (Through Si Photonic Via) and UDOC (Uni-Directional Optical Coupler). We successfully fabricated TSPV with a diameter of 10um showing excellent optical confinement. We proposed and fabricated a new optical grating coupler with side mirror. We confirmed that vertical optical signal propagated through TSPV was coupled to horizontal Si nano optical waveguide using this optical grating coupler with high coupling efficiency of more than 80%.