Development of UV-Assisted Polishing Technology to Realize Diamond Wafer for Power Electric Devices

金刚石材料具有优良的材料性能，有望成为未来功率器件的衬底材料。另一方面，由于金刚石的化学和物理性质，蚀刻和机械加工非常困难。由于器件材料必须在抛光衬底下无晶体畸变地抛光，因此特别需要伴随的简化的平坦化技术。在实验室对单晶金刚石衬底的紫外光激发抛光进行了研究，发现紫外光辅助抛光具有较高的抛光速率和上级表面粗糙度。通过使用这些抛光技术，我们可以使用金刚石作为未来功率器件的衬底材料，因为我们能够抛光镶嵌晶片，并最大限度地减少抛光衬底上位错的发生。

Diamond materials are expected to be used as future substrates for power devices because they have excellent material properties. On the other hand, etching and mechanical processing are very difficult because of the chemical and physical properties of diamond. As device materials must be polished without crystallographic distortion beneath a polished substrate, simplified planarization techniques accompanied are especially required. Ultraviolet rays excited polishing of single crystal diamond substrates has been studied in our laboratory, and the UV-assisted polishing characteristics, such as a higher polishing rate and superior final surface roughness, have been revealed. By using these polishing techniques, we can use diamond as a substrate material for future power devices because we are able to polish a mosaic wafer, and minimize the occurrence of dislocation on the polished substrate.