Development of UV-Assisted Polishing Technology to Realize Diamond Wafer for Power Electric Devices

点击翻译按钮获取中文摘要

Diamond materials are expected to be used as future substrates for power devices because they have excellent material properties. On the other hand, etching and mechanical processing are very difficult because of the chemical and physical properties of diamond. As device materials must be polished without crystallographic distortion beneath a polished substrate, simplified planarization techniques accompanied are especially required. Ultraviolet rays excited polishing of single crystal diamond substrates has been studied in our laboratory, and the UV-assisted polishing characteristics, such as a higher polishing rate and superior final surface roughness, have been revealed. By using these polishing techniques, we can use diamond as a substrate material for future power devices because we are able to polish a mosaic wafer, and minimize the occurrence of dislocation on the polished substrate.