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Molecular design of copper Damascene additive which fills via by only one organic additive

Molecular design of copper Damascene additive which fills via by only one organic additive
仅用一种有机添加剂填充通孔的铜镶嵌添加剂的分子设计
批准号:
23560872
负责人:
KONDO Kazuo
金额:
$3.08万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011 至 2013

项目摘要

项目成果

KONDO Kazuo的其他基金

相关文献

中文摘要
翻译
我们已经发现,代替传统的四种添加剂,只有一种有机添加剂是有效的填充通孔。 电化学测量和QCM解释了填充机制。 通过对侧链的重新设计,我们发现了新的添加剂。 二烯丙基胺添加剂也可有效用作常规四种添加剂的整平剂。
英文摘要
We have found that instead of the conventional four additive, only one organic additive is effective to fill the via. Electrochemical measurements and QCM explains the filling mechanism. By newly designing the side chain we have foud the new additives. The diallylamine additive is also effective to use as the leveler for the conventional four additive.
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会议论文
Diallylamine levelers side chains effect on copper via filling
二烯丙基胺整平剂侧链对铜通孔填充的影响
DOI: --
发表时间: 2013
期刊:
影响因子: --
作者: [Y. Yamada, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi]
通讯作者: M. Bunya and M. Yokoi
DOI: --
发表时间: 2013
期刊:
影响因子: --
作者: [丸中 正雄, 土屋 貴之, 林 太郎, 岡本 尚樹 , 齊藤 丈靖, 横井 昌幸, 近藤 和夫]
通讯作者: 近藤 和夫
Single Diallyamine Type Copolymer Additive Which Perfectly Bottom-up Fills Cu Electrodeposition
单一二烯丙胺型共聚物添加剂,完美自下而上填充铜电沉积
DOI: --
发表时间: 2011
期刊:
影响因子: --
作者: [M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. saito]
通讯作者: T. saito
Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper
二烯丙胺型共聚物添加剂侧链氨基碱性对铜填孔的影响
DOI: 10.1149/2.021312jes
发表时间: 2013
期刊: ECS
影响因子: --
作者: [M. Takeuchi, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, and K. Kondo]
通讯作者: and K. Kondo
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