Molecular design of copper Damascene additive which fills via by only one organic additive
Molecular design of copper Damascene additive which fills via by only one organic additive
批准号:
23560872
负责人:
KONDO Kazuo
金额:
$3.08万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011 至 2013
中文摘要
我们已经发现,代替传统的四种添加剂,只有一种有机添加剂是有效的填充通孔。 电化学测量和QCM解释了填充机制。 通过对侧链的重新设计,我们发现了新的添加剂。 二烯丙基胺添加剂也可有效用作常规四种添加剂的整平剂。
英文摘要
We have found that instead of the conventional four additive, only one organic additive is effective to fill the via. Electrochemical measurements and QCM explains the filling mechanism. By newly designing the side chain we have foud the new additives. The diallylamine additive is also effective to use as the leveler for the conventional four additive.
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Diallylamine levelers side chains effect on copper via filling
二烯丙基胺整平剂侧链对铜通孔填充的影响
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
[Y. Yamada, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi]
通讯作者:
M. Bunya and M. Yokoi
スパッタイオンプレーティング法によるCuシード膜の作製
溅射离子镀法制备Cu籽晶膜
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
[丸中 正雄, 土屋 貴之, 林 太郎, 岡本 尚樹 , 齊藤 丈靖, 横井 昌幸, 近藤 和夫]
通讯作者:
近藤 和夫
Single Diallyamine Type Copolymer Additive Which Perfectly Bottom-up Fills Cu Electrodeposition
单一二烯丙胺型共聚物添加剂,完美自下而上填充铜电沉积
DOI:
--
发表时间:
2011
期刊:
影响因子:
--
作者:
[M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. saito]
通讯作者:
T. saito
Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper
二烯丙胺型共聚物添加剂侧链氨基碱性对铜填孔的影响
DOI:
10.1149/2.021312jes
发表时间:
2013
期刊:
ECS
影响因子:
--
作者:
[M. Takeuchi, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, and K. Kondo]
通讯作者:
and K. Kondo
銅穴埋めめっきにおけるジアリルアミン系レベラーの影響
二烯丙基胺整平剂对铜孔填充电镀的影响
DOI:
--
发表时间:
2013
期刊:
影响因子:
--
作者:
[山田康貴, 竹内実, 岡本尚樹, 齋藤丈靖, 文屋勝, 横井昌幸, 近藤和夫]
通讯作者:
近藤和夫
共 23 条
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The effect of food factors on postprandial hyperlipidemia - the search for food factors and the clarification of those mechanisms -
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Construction of System for Formation of Chitin Oligomer Having Highly Physiological Activity by Enzymatic Hydrolysis Reaction
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Acceleration and inhibition effects on via filling electrodeposition were discussed
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Crystal growth and contral of nano-level zinc alloy electrodeposits
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High Density Interconnection and Packaging Chemical Engineering in 21st Century
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DEVELOPMENT OF IN-SITSU MEMBRANE SEPARATION PROCESS FOR ORGANIC ACID FERMENTATION
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Processins Technology of High Density Interconnection Bumps
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Novel Technique of Separation and Purification of Palladium with Liquid Membrane
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负责人:KONDO Kazuo
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依托单位: