Development of Crystalline Anisotropic Plasma Etching for Single Crystal Silicon

在这项研究中，我们提出了一种新的制造工艺，复杂的三维硅微结构使用的晶体各向异性等离子体蚀刻的单晶硅与普通RIE工艺在常温下。提出的工艺结合了传统的各向同性，传统的垂直各向异性，和晶体各向异性硅等离子体刻蚀实现了复杂的微结构下的所有干工艺与单一的RIE机与单一的掩模。为了证实所提出的工艺的有效性，我们展示了制作悬臂梁和微针的生物应用。在悬臂的情况下，从衬底释放的悬臂以常规工艺的1/5处理时间制造。在一台干法刻蚀设备上制作复杂的三维硅微结构是可能的。

In this study, we propose a novel fabrication process for complicated three-dimensional silicon microstructures using the crystalline anisotropic plasma etching of the single crystal silicon with an ordinary RIE process under the normal temperature. The proposed process combined of the conventional isotropic, the conventional vertical anisotropic, and the crystalline anisotropic silicon plasma etchings achieves the complicated microstructures under all dry process with single RIE machine with single mask. To confirm the validity of the proposed process, we demonstrated to fabricate a cantilever and a micro needle for bio-application. In the case of the cantilever, the cantilever released from a substrate was fabricated at 1/5 processing time of the conventional process. It is possible that the complicated three-dimensional silicon microstructures are fabricated in single dry etching equipment.