Development of fault detection/diagnosis method of multi-layered interconnection in LSI circuit by AFM mechanism

利用AFM机制开发LSI电路多层互连故障检测/诊断方法

• 批准号: 23656101
• 负责人: MORITA Noboru
• 金额: $ 1.91万
• 依托单位: Chiba University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Challenging Exploratory Research
• 财政年份: 2011
• 资助国家: 日本
• 起止时间: 2011 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23656101/
• 关键词: ナノ; マイクロ加工; AFM; LSI回路; 故障診断; ダイヤモンド; マイクロ・ナノ加工; LSI; 故障解析

A new fault detection/diagnosis method of multi-layered interconnection in LSI circuit was developed using diamond tools attached on AFM cantilevers. The effects of configuration of a cutting edge and stiffness of a cantilever on removal characteristics of a surface thin layer were investigated. As a result, the removed depth of more than 3.0 μm was achieved by utilizing a high stiffness cantilever. And also, the precise control of applied load to cantilever enabled the observation and evaluation of buried wires at intended removed depth. The present study provides more reliable fault detection/diagnosis method than conventional removal methods such as chemical etching and mechanical polishing.

提出了一种将金刚石工具附加在AFM悬臂梁上的大规模集成电路多层互连故障检测/诊断方法。研究了切削刃形态和悬臂梁刚度对表面薄层去除特性的影响。通过采用高刚度悬臂梁，实现了大于3.0 μm的去除深度。此外，对悬臂梁施加载荷的精确控制使得在预定移除深度处对埋线进行观察和评估成为可能。本研究提供了比化学蚀刻、机械抛光等常规去除方法更可靠的故障检测/诊断方法。