Development of fault detection/diagnosis method of multi-layered interconnection in LSI circuit by AFM mechanism

利用原子力显微镜悬臂梁上的金刚石工具，提出了一种新的大规模集成电路多层互连故障检测/诊断方法。研究了刃口形状和悬臂梁刚度对表面薄层去除特性的影响。结果，利用高刚度悬臂梁，去除深度可达3μm以上。此外，对施加到悬臂上的载荷进行精确控制，使得能够观察和评估预期移除深度处的埋线。本研究提供了比化学腐蚀和机械抛光等传统去除方法更可靠的故障检测/诊断方法。

A new fault detection/diagnosis method of multi-layered interconnection in LSI circuit was developed using diamond tools attached on AFM cantilevers. The effects of configuration of a cutting edge and stiffness of a cantilever on removal characteristics of a surface thin layer were investigated. As a result, the removed depth of more than 3.0 μm was achieved by utilizing a high stiffness cantilever. And also, the precise control of applied load to cantilever enabled the observation and evaluation of buried wires at intended removed depth. The present study provides more reliable fault detection/diagnosis method than conventional removal methods such as chemical etching and mechanical polishing.