Development of fault detection/diagnosis method of multi-layered interconnection in LSI circuit by AFM mechanism

提出了一种将金刚石工具附加在AFM悬臂梁上的大规模集成电路多层互连故障检测/诊断方法。研究了切削刃形态和悬臂梁刚度对表面薄层去除特性的影响。通过采用高刚度悬臂梁，实现了大于3.0 μm的去除深度。此外，对悬臂梁施加载荷的精确控制使得在预定移除深度处对埋线进行观察和评估成为可能。本研究提供了比化学蚀刻、机械抛光等常规去除方法更可靠的故障检测/诊断方法。

A new fault detection/diagnosis method of multi-layered interconnection in LSI circuit was developed using diamond tools attached on AFM cantilevers. The effects of configuration of a cutting edge and stiffness of a cantilever on removal characteristics of a surface thin layer were investigated. As a result, the removed depth of more than 3.0 μm was achieved by utilizing a high stiffness cantilever. And also, the precise control of applied load to cantilever enabled the observation and evaluation of buried wires at intended removed depth. The present study provides more reliable fault detection/diagnosis method than conventional removal methods such as chemical etching and mechanical polishing.