Micro-Fabrication by Using Combination Technique of Nano-scale Machining and Alkaline Etching

纳米加工与碱性蚀刻相结合的微细加工

• 批准号: 13650112
• 负责人: MORITA Noboru
• 金额: $ 1.6万
• 依托单位: Toyama university (2002)Chiba University (2001)
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650112/
• 关键词: Friction Force Microscope; Single Crystal Silicon; Alkaline Etching; Cantilever for Machining; 3D Micro-Fabrication; Affected layer; Normal load; Pitch of processing line; 加工変質層; マイクロ加工; カンチレバー; エッチングマスク

Masking effect was appeared to the processing region when the (100) surface of single crystal silicon processed by using the mechanism of friction force microscope (FFM) was etched by KOH solution. In this research, mechanizm of this phenomenon and method to fabricate the microstructure by utilizing this phenomenon was researched. Moreover, the research to fabricate 3D microstructure was carried out by controlling nano-scale processing conditions.Processing region was analyzed by TEM, Laser Raman spectroscopy and etc. As a result, it was found that there is a low crystalline layer under the processing surface. And there is affected layer with crystal dislocation under the first layer. From these results, masking effect was provided by low crystalline layer when concentration of KOH solution is less than 20 wt%. On the other hand, enhanced etching effect was provided by affected layer with crystal dislocation in higher concentration of KOH solution more than 20 wt%. Surface roughness and shape of structure was improved by addition of ultrasonic wave in etching process. Moreover, masking effect of FFM processing region was changed by controlling the condition of normal load and pitch of processing line. By utilizing this technique, 3D micro-structure was fabricated. In the future, research about fabrication of higher precision structure will be carried out by development of machining cantilever and optimization of processing condition.

利用摩擦力显微镜（FFM）机构加工的单晶硅（100）面用KOH溶液刻蚀时，对加工区域出现掩蔽效应。本文研究了这种现象的产生机理以及利用这种现象制作微结构的方法。通过控制纳米尺度的加工条件，对加工区域进行了TEM、激光拉曼光谱等分析，发现加工表面下存在低结晶层。在第一层的下面还有位错影响层。从这些结果来看，当KOH溶液的浓度小于20wt%时，低结晶层提供了掩蔽效应。另一方面，在高于20wt%的较高浓度的KOH溶液中，通过具有晶体位错的影响层提供增强的蚀刻效果。通过在刻蚀过程中加入超声波，改善了结构的表面粗糙度和形状。通过控制法向载荷和加工线间距，改变了FFM加工区域的掩模效果。利用该技术制作了三维微结构。今后将通过开发悬臂梁加工技术和优化加工条件，开展更高精度结构的加工研究。