PRINTED CIRCUIT BOARD DESIGN OF A RF OSCILLATOR

射频振荡器的印刷电路板设计

• 批准号: 7369278
• 负责人: PETER B. O'CONNOR
• 金额: $ 0.09万
• 依托单位: BOSTON UNIVERSITY MEDICAL CAMPUS
• 依托单位国家: 美国
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-07-01 至 2007-06-30
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/7369278
• 关键词: PRINTED; CIRCUIT; BOARD; DESIGN; RF

This subproject is one of many research subprojects utilizing the resources provided by a Center grant funded by NIH/NCRR. The subproject and investigator (PI) may have received primary funding from another NIH source, and thus could be represented in other CRISP entries. The institution listed is for the Center, which is not necessarily the institution for the investigator. A high voltage RF oscillator circuit was previously constructed in the BU/NCRR mass spectrometry resource. This robust, tunable RF oscillator circuit could be used to cheaply drive multipole ion guides in FTICR. This project involved designing of a printed circuit board for the oscillator circuit in order to simplify construction and minimize debugging of these circuits. The circuit is laid out on a 2 layer PCB using the CAD tool, Layout Plus by Cadence Inc. The board outline is 5 by 4 (inches). The traces carrying high current dissipate a lot of heat (i2* R*t). These are made wider to prevent the melting of Cu tracks. Also, the nets which are at high potential (approx. 300 volts RF) can cause arcing or insulation breakdown between adjacent tracks. To prevent this, spacing between these H.V. traces is increased (approx. 200 mils for RF and 100 mils for DC). It has also been kept in mind to keep the RF components separate from the DC components in the layout of the circuit. A PCB has been developed, and is currently being assembled for testing.

该子项目是利用NIH/NCRR资助的中心赠款提供的资源的许多研究子项目之一。子项目和研究者（PI）可能从另一个NIH来源获得主要资金，因此可以在其他CRISP条目中表示。所列机构为中心，不一定是研究者所在机构。之前在BU/NCRR质谱资源中构建了高压RF振荡器电路。 这种鲁棒的、可调谐的RF振荡器电路可用于廉价地驱动FTICR中的多极离子引导器。该项目涉及设计用于振荡器电路的印刷电路板，以简化结构并最大限度地减少这些电路的调试。使用CAD工具Cadence Inc.的Layout Plus将电路布置在2层PCB上。电路板轮廓为5 × 4英寸。承载高电流的迹线耗散大量热量（i2* R*t）。这些被做得更宽以防止Cu轨道的熔化。此外，网络是在高电位（约。300伏RF）可能导致相邻走线之间的电弧放电或绝缘击穿。为了防止这种情况，这些H. V.迹线之间的间距增加（约RF为200密耳，DC为100密耳）。还应记住，在电路布局中，应将RF组件与DC组件分开。已经开发了PCB，目前正在组装测试。