New Thyristors for T & D Applications (NEWTON)
New Thyristors for T & D Applications (NEWTON)
批准号:
DT/E005837/1
负责人:
David Whalley
金额:
$24.21万
依托单位:
依托单位国家:
英国
项目类别:
Research Grant
财政年份:
2007
资助国家:
英国
项目状态:
已结题
起止时间:
2007 至 --
中文摘要
点击翻译按钮获取中文摘要
英文摘要
Thyristors are semiconductor devices based on silicon that are used to switch high voltages and currents, and are used in power electronic converters for Transmission & Distribution (T&D) applications. In order to transmit these high powers these devices rely heavily on minimising conduction losses by maximising the diameter of the silicon device and by making very low resistance electrical contacts. In order to maintain these low resistance contacts during long term service, these devices must currently be enclosed in a hermetic ceramic package that prevents the ingress of moisture. However, this package is expensive and represents a significant part of the cost of the device. An existing research project is investigating ways to improve these devices by developing a new bonding approach to create low resistance electrical contacts that is predicted to lead to improvements in surge capability and will enable larger diameter silicon devices to be manufactured. However the introduction of this new bonding approach also opens the way for novel designs of packaging with less stringent sealing requirements enabling the replacement of the traditional ceramic enclosures. The purpose of this research project is to investigate alternative methods of packaging that will enable these devices to be manufactured at substantially lower cost. The work will consider the use of new materials and processes to meet the electrical, mechanical and thermal requirements of the devices that must remain reliable when used for long periods of time. The successful outcome of the research will benefit the UK electronics industry by providing a high performance product at a competitive price that will enable them to meet the demands of growing international markets. Furthermore, moving to novel, non-ceramic packaging technologies will reduce the resource and energy cost of manufacture and enhance the recyclability of the end-of-life products. .
期刊论文(2)
专著(0)
科研奖励(0)
会议论文
Polymeric packaging of high power semiconductor devices: Material selection & reliability assessment
高功率半导体器件的聚合物封装:材料选择
DOI:
10.1109/eptc.2013.6745696
发表时间:
2013
期刊:
影响因子:
--
作者:
[Nobeen N]
通讯作者:
Nobeen N
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依托单位:
海外基金