New Thyristors for T & D Applications (NEWTON)

晶闸管是基于硅的半导体器件，用于切换高压和电流，并用于输配电（T&D）应用的电力电子转换器。为了传输这些高功率，这些器件在很大程度上依赖于通过最大化硅器件的直径和制造非常低电阻的电接触来最小化传导损耗。为了在长期使用期间保持这些低电阻触点，这些设备目前必须封装在密封陶瓷封装中，以防止水分进入。然而，这个封装是昂贵的，并且代表了设备成本的重要部分。一个现有的研究项目正在研究如何通过开发一种新的键合方法来改善这些设备，以创造低电阻电触点，预计这将导致浪涌能力的提高，并将使更大直径的硅设备得以制造。然而，这种新的粘合方法的引入也为新颖的包装设计开辟了道路，其密封要求不那么严格，可以替代传统的陶瓷外壳。本研究项目的目的是研究可替代的包装方法，使这些设备能够以较低的成本制造。这项工作将考虑使用新的材料和工艺，以满足设备的电气、机械和热要求，这些设备在长时间使用时必须保持可靠。这项研究的成功结果将使英国电子工业受益，以具有竞争力的价格提供高性能的产品，使他们能够满足不断增长的国际市场的需求。此外，转向新颖的非陶瓷包装技术将降低制造的资源和能源成本，并提高报废产品的可回收性。

Thyristors are semiconductor devices based on silicon that are used to switch high voltages and currents, and are used in power electronic converters for Transmission & Distribution (T&D) applications. In order to transmit these high powers these devices rely heavily on minimising conduction losses by maximising the diameter of the silicon device and by making very low resistance electrical contacts. In order to maintain these low resistance contacts during long term service, these devices must currently be enclosed in a hermetic ceramic package that prevents the ingress of moisture. However, this package is expensive and represents a significant part of the cost of the device. An existing research project is investigating ways to improve these devices by developing a new bonding approach to create low resistance electrical contacts that is predicted to lead to improvements in surge capability and will enable larger diameter silicon devices to be manufactured. However the introduction of this new bonding approach also opens the way for novel designs of packaging with less stringent sealing requirements enabling the replacement of the traditional ceramic enclosures. The purpose of this research project is to investigate alternative methods of packaging that will enable these devices to be manufactured at substantially lower cost. The work will consider the use of new materials and processes to meet the electrical, mechanical and thermal requirements of the devices that must remain reliable when used for long periods of time. The successful outcome of the research will benefit the UK electronics industry by providing a high performance product at a competitive price that will enable them to meet the demands of growing international markets. Furthermore, moving to novel, non-ceramic packaging technologies will reduce the resource and energy cost of manufacture and enhance the recyclability of the end-of-life products. .