An Advanced SEM-FIB Dual Beam Microscope for Three-Dimensional Mesoscale Fabrication, Imaging and Analysis

用于三维介观尺度制造、成像和分析的先进 SEM-FIB 双光束显微镜

• 批准号: EP/E012477/1
• 负责人: Paul Midgley
• 金额: $ 155.94万
• 依托单位: University of Cambridge
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2007
• 资助国家: 英国
• 起止时间: 2007 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FE012477%2F1
• 关键词: Advanced; SEM; FIB; Dual; Beam

The growth and fabrication of modern structures and devices has now developed in order to exploit the full three-dimensional behaviour of the materials used. Whether its in structural materials, such as ultra-fine ceramic-metal composites, or in functional materials, where transistor structures composed of a 3D 'latticework' of key components, there is a pressing need to understand the structure, composition and physico-chemical properties of modern materials in three dimensions. Over the past 5 years we have developed transmission electron tomographic techniques to investigate, with nanometre resolution, the internal architecture of many materials systems, including heterogeneous catalysts, nanotubes and quantum dots. However, it is important to link the structure-properties relationships over many length scales, from nanometres (10-9m) to microns (10-6m) through to millimetres (10-3m). Although, x-ray tomography and related techniques are used with great effect at length scales ~ few microns, this proposal addresses the development of techniques to give the ability to analyse, in three dimensions, the structure and composition of a range of materials at a meso-scale, from 10's microns to 10 nm, bridging the gap between transmission electron tomography and x-ray tomography.Such 3D analysis can now be undertaken using a combined scanning electron microscope (SEM) / focussed ion beam (FIB) microscope. This instrument, known as a 'Dual Beam microscope', uses the milling action of a gallium ion beam to reveal internal surfaces and an electron beam to record successive image slices (to give 3D morphology). Either secondary electrons (for maximum surface detail) or back-scattered electrons (which has atomic number contrast) can be used to form images.The instrument will have a field emission gun (FEG) electron source for optimum brightness and image resolution, and advanced analytical tools including an electron backscattered diffraction (EBSD) detector for 3D crystallographic studies, and an energy-dispersive X-ray (EDX) detector system to map the composition of the specimen in 3D. It will have an internal micromanipulator for handling micron-sized specimens and an in-situ straining stage will be incorporated to measure the mechanical response of micron-sized components. As well as yielding new areas of research combining electron and ion sources, the individual components of the Dual Beam will have a performance better than any of the single-beam SEMs and FIB currently available to us. In particular, the EBSD system will be ~100x faster than our present system and milling times with the FIB reduced by up to a factor of 5.In addition to the 3D imaging and analysis, we propose to use a dual beam workstation to fabricate novel electronic device structures and develop novel sample geometries for a wide range of state-of-the-art transmission electron microscopic techniques. In particular, for TEM specimens the dual beam requested in this proposal allows low energy ion thinning of membranes to remove implantation damage. Subsequent micromanipulation of the plucked free-standing membrane onto a specially prepared grid will then allow full 360 degree tilt and rotation when in the TEM, vital for advanced electron tomographic analysis.

现代结构和设备的生长和制造现在已经发展到利用所使用的材料的全三维行为。无论是在结构材料中，如超细陶瓷-金属复合材料，还是在功能材料中，其中晶体管结构由关键部件的3D“晶格”组成，都迫切需要了解现代材料的三维结构，组成和物理化学性质。在过去的5年里，我们已经开发出透射电子断层扫描技术，以纳米分辨率调查，许多材料系统，包括非均相催化剂，纳米管和量子点的内部结构。然而，重要的是要在许多长度尺度上联系结构-性能关系，从纳米（10- 9米）到微米（10- 6米）再到毫米（10- 3米）。尽管X射线断层扫描和相关技术在长度尺度~几微米上的使用效果很大，但本提案提出了技术的发展，以提供在三维中分析从10微米到10 nm的中尺度的一系列材料的结构和组成的能力，这种3D分析现在可以使用组合的扫描电子显微镜（SEM）/聚焦离子束（FIB）显微镜进行。该仪器被称为“双光束显微镜”，使用镓离子束的研磨作用来显示内表面，并使用电子束来记录连续的图像切片（以给出3D形态）。要么是次级电子（最大表面细节）或背散射电子（具有原子序数对比度）可用于形成图像。该仪器将具有场发射枪（FEG）电子源以获得最佳亮度和图像分辨率，以及先进的分析工具，包括用于3D晶体学研究的电子背散射衍射（EBSD）检测器，以及能量色散X射线（EDX）检测器系统，用于以3D方式绘制样本的成分。它将有一个内部的显微操作器处理微米尺寸的标本和一个原位应变阶段将被纳入测量微米尺寸的组件的机械响应。除了结合电子和离子源产生新的研究领域外，双束的各个组件的性能将优于我们目前可用的任何单束SEM和FIB。特别是，EBSD系统将比我们目前的系统快100倍，FIB的铣削时间减少了5倍。除了3D成像和分析，我们建议使用双光束工作站来制造新型电子器件结构，并为各种最先进的透射电子显微镜技术开发新的样品几何形状。特别地，对于TEM试样，在该提议中要求的双束允许低能量离子减薄膜以去除注入损伤。随后将拔出的独立膜微操作到专门准备的网格上，然后在TEM中允许完全360度倾斜和旋转，这对于先进的电子断层扫描分析至关重要。

项目成果

Publisher's Note: Magnetic structure of individual flux vortices in superconducting MgB 2 derived using transmission electron microscopy [Phys. Rev. B 87 , 144515 (2013)]

出版商注：使用透射电子显微镜导出的超导 MgB 2 中各个通量涡旋的磁结构 [Phys.

• DOI: 10.1103/physrevb.87.179903
• 发表时间: 2013
• 期刊: Physical Review B
• 影响因子: 3.7
• 作者: Loudon J

Micropillar compression of ceramics at elevated temperatures

• DOI: 10.1016/j.scriptamat.2009.01.029
• 发表时间: 2009-05-01
• 期刊: SCRIPTA MATERIALIA
• 影响因子: 6
• 作者: Korte, S.;Clegg, W. J.
• 通讯作者: Clegg, W. J.

Three-dimensional electron backscattered diffraction analysis of deformation in MgO micropillars

• DOI: 10.1016/j.actamat.2011.08.022
• 发表时间: 2011-11-01
• 期刊: ACTA MATERIALIA
• 影响因子: 9.4
• 作者: Korte, S.;Ritter, M.;Clegg, W. J.
• 通讯作者: Clegg, W. J.