Dicing saw for advanced micro/nano integration facility

用于先进微纳集成设备的划片锯

• 批准号: 359958-2008
• 负责人: Okoniewski, Michal
• 金额: $ 3.23万
• 依托单位: University of Calgary
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments - Category 1 (<$150,000)
• 财政年份: 2007
• 资助国家: 加拿大
• 起止时间: 2007-01-01 至 2008-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=366492
• 关键词: Dicing; saw; advanced; micro; nano

We propose to purchase a Disco DAD 321 dicing saw with a compatible wafer mounting system. Dicing saw machine is a fundamental piece of equipment in microelectronic fabrication and integration. It allows for cutting of larger wafers into chips as well as for preparation of specialized materials to be integrated on chips and other micro scale devices.  While the machine will be used in a variety of projects across the University and by outside users, the immediate needs for the devices stems from our project to build a nuclear magnetic resonance on a chip sensor for use in bio-engineering.

我们建议购买一台Disco DAD 321切割锯，配有兼容的晶圆安装系统。划片机是微电子制造和集成的基础设备。它允许将较大的晶片切割成芯片，以及准备要集成在芯片和其他微尺度设备上的专用材料。虽然该机器将用于整个大学和外部用户的各种项目，但对设备的迫切需求源于我们的项目，即在芯片上构建用于生物工程的核磁共振传感器。