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Rapid thermal annealing (RTA) system for advanced CMOS, MEMs, and polymer-based materials and devices

Rapid thermal annealing (RTA) system for advanced CMOS, MEMs, and polymer-based materials and devices
适用于先进 CMOS、MEM 以及聚合物材料和器件的快速热退火 (RTA) 系统
批准号:
374559-2009
负责人:
Buchanan, Douglas
金额:
$5.97万
依托单位:
依托单位国家:
加拿大
项目类别:
Research Tools and Instruments - Category 1 (<$150,000)
财政年份:
2008
资助国家:
加拿大
项目状态:
已结题
起止时间:
2008-01-01 至 2009-12-31

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中文摘要
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英文摘要
Dimensional scaling of many different types of materials and devices has been required to continue to meet the demands of the ever-increasing performance requirements. To produce advanced materials and devices, precise control on the scale of individual atoms is required. This type of control is required for many research areas, including, advanced silicon-based materials and devices, polymer-based devices for memory and sensor applications, micro-electro-mechanical systems (MEMS), photonic bandgap materials and devices, etc.. It is the acquisition of a Rapid Thermal Annealing (RTA) system that is the focus of this proposal. The RTA system is required for material and device fabrication to maintain precise control of temperature, ambient and timescales (seconds) where tradition thermal furnaces cannot be used.
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