Rapid thermal annealing (RTA) system for advanced CMOS, MEMs, and polymer-based materials and devices

许多不同类型的材料和设备的尺寸缩放需要继续满足不断增长的性能要求。为了生产先进的材料和设备，需要对单个原子的尺寸进行精确控制。许多研究领域都需要这种类型的控制，包括先进的硅基材料和器件、用于存储器和传感器应用的聚合物基器件、微机电系统（MEMS）、光子带隙材料和器件等。快速热退火（RTA）系统的采购是本提案的重点。材料和器件制造需要 RTA 系统，以保持对温度、环境和时间尺度（秒）的精确控制，而传统热熔炉无法使用。

Dimensional scaling of many different types of materials and devices has been required to continue to meet the demands of the ever-increasing performance requirements. To produce advanced materials and devices, precise control on the scale of individual atoms is required. This type of control is required for many research areas, including, advanced silicon-based materials and devices, polymer-based devices for memory and sensor applications, micro-electro-mechanical systems (MEMS), photonic bandgap materials and devices, etc.. It is the acquisition of a Rapid Thermal Annealing (RTA) system that is the focus of this proposal. The RTA system is required for material and device fabrication to maintain precise control of temperature, ambient and timescales (seconds) where tradition thermal furnaces cannot be used.