Rapid thermal annealing (RTA) system for advanced CMOS, MEMs, and polymer-based materials and devices

适用于先进 CMOS、MEM 以及聚合物材料和器件的快速热退火 (RTA) 系统

• 批准号: 374559-2009
• 负责人: Buchanan, Douglas
• 金额: $ 5.97万
• 依托单位: University of Manitoba
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments - Category 1 (<$150,000)
• 财政年份: 2008
• 资助国家: 加拿大
• 起止时间: 2008-01-01 至 2009-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=411960
• 关键词: Rapid; thermal; annealing; RTA; system

Dimensional scaling of many different types of materials and devices has been required to continue to meet the demands of the ever-increasing performance requirements. To produce advanced materials and devices, precise control on the scale of individual atoms is required. This type of control is required for many research areas, including, advanced silicon-based materials and devices, polymer-based devices for memory and sensor applications, micro-electro-mechanical systems (MEMS), photonic bandgap materials and devices, etc.. It is the acquisition of a Rapid Thermal Annealing (RTA) system that is the focus of this proposal. The RTA system is required for material and device fabrication to maintain precise control of temperature, ambient and timescales (seconds) where tradition thermal furnaces cannot be used.

为了继续满足不断增长的性能要求，需要对许多不同类型的材料和器件进行尺寸缩放。为了生产先进的材料和设备，需要对单个原子的规模进行精确控制。这种类型的控制是许多研究领域所需要的，包括先进的硅基材料和器件、用于存储和传感器应用的聚合物基器件、微电子机械系统(MEMS)、光子带隙材料和器件等。收购快速热退火(RTA)系统是本提案的重点。RTA系统是材料和设备制造所必需的，以保持对温度、环境和时间(秒)的精确控制，在传统热炉无法使用的地方。