Wireless microelectromechanical integrated sensors

与激光器或集成电路一样，微机电系统（MEMS）是一种颠覆性技术，它可以增强现有系统并实现新的应用。预计MEMS市场将在未来三年内显著增长（每年14%至19%），并将涉及许多不同的新兴应用，如微显示器，燃料电池，流体和传感器。MEMS传感器在消费者市场中的存在越来越多，具有大量的商业化设备，例如运动控制手持设备、安全气囊部署系统和麦克风。此外，由于它们是移动的，MEMS传感器非常适合无线接口用于遥测传输。MEMS用与用于制造集成电路的技术类似的技术制造。因此，互补金属氧化物半导体（CMOS）芯片是实现MEMS传感器内包括的无线接口和数据处理电路的自然选择。然而，由于微制造工艺的不兼容性、MEMS专用电路设计的复杂性以及系统封装的高成本，CMOS和MEMS技术的集成仍然很困难。

Like lasers or integrated circuits, microelectromechanical systems (MEMS) are a disruptive technology, which enhances existing systems and enables new applications. It is projected that the MEMS market will experience significant growth over the next three years (14 to 19% per year), and will involve many different emerging applications such as micro displays, fuel cells, fluidics, and sensors. MEMS sensors have had an increased presence in the consumer market, with a significant number of commercialized devices such as motion controlled handhelds, airbags deployment systems, and microphones. In addition, because they are mobile, MEMS sensors are well suited to wireless interfaces for the transmission of telemetry. MEMS are fabricated with similar technologies to those used for the fabrication of integrated circuits. As such, complementary metal-oxide-semiconductor (CMOS) chips are a natural choice for implementing the wireless interfaces and the data processing circuitry included within MEMS sensors. However, the integration of CMOS and MEMS technologies remains difficult because of microfabrication process incompatibilities, MEMS-specific circuit design intricacies, and high cost of system packaging.