Microelectromechanical Low-power Strain Sensor for Structural Health Monitoring Applications
Microelectromechanical Low-power Strain Sensor for Structural Health Monitoring Applications
批准号:
520540-2017
负责人:
Nabki, Frederic
金额:
$0.91万
依托单位国家:
加拿大
项目类别:
Engage Plus Grants Program
财政年份:
2017
资助国家:
加拿大
项目状态:
已结题
起止时间:
2017-01-01 至 2018-12-31
中文摘要
点击翻译按钮获取中文摘要
英文摘要
Strain sensors suited for the structural health monitoring (SHM) of airplanes are often not miniaturised orrequire significant amounts of power, leading to difficulties in accessing constrained locations, prohibitivelyheavy cabling, and frequent and expensive battery maintenance. Microelectromechanical systems (MEMS) canreduce the size and power consumption of these sensors. However, the associated sensing electronics requiresignificant amounts of power to condition the analog signals from the MEMS transducer.To resolve this, IPR inc. is proposing a digital-output MEMS transducer design, along with the monitoringlow-power electronics, that is tailored for SHM of airplanes in a compact form-factor and low-power signalingscheme. IPR's MEMS transducer is based on a direct contact structure that allows for on/off type of detectionof a strain variation that moves a shuttle mass. This unique and effective solution will allow IPR to create anaffordable and power efficient strain sensing SHM system. However, the current solution has metmicro-fabrication yield issues and questions remain regarding its contact-based sensing scheme. This requiresthe current strain transducer design to be revisited and its implementation in a stable and robust commercialMEMS fabrication process. IPR wants to continue its collaboration with Prof. Frederic Nabki at ETS throughthis Engage Plus project to refine the MEMS strain sensor design proposed in the previous Engage project andcharacterise the initial prototypes fabricated. This transducer will later be integrated within IPR's customlow-power interface electronics to implement a complete strain sensing system for SHM.This project is a key building block of IPR's low-power and compact strain sensor, and will be a springboardtowards a leadership market position. The innovative MEMS device resulting from this project will ultimatelyenable the implementation of novel network of sensors well-suited to various traditionally inaccessibleenvironments. This project will provide training for HQP (one research professional, one master's student an
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