System-Level Modeling and Analysis of 3D Multi-Processors on Chip for Future Cloud Computing

面向未来云计算的片上 3D 多处理器的系统级建模和分析

• 批准号: RGPIN-2014-03691
• 负责人: Nicolescu, Gabriela
• 金额: $ 1.82万
• 依托单位: École Polytechnique de Montréal
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2014
• 资助国家: 加拿大
• 起止时间: 2014-01-01 至 2015-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=566033
• 关键词: System; Level; Modeling; Analysis; 3D

As our economy and society is mainly based on digital information, during the last decade an emergence of a digital universe occurred. As a consequence of this evolution, cloud computing and data centers have become ubiquitous - they are essential in nearly every sector of the economy and have become the backbone for communications, business, academic, and governmental systems. However, several challenges will be faced in the near future. With the new applications in the cloud and the massive data to be processed, the computing performance requirements are increasing dramatically. Today’s supercomputers’ power is expressed in several PFLOPS (1015 Floating Point Operations per Second) and 1MW is required for one PFLOP. The requirements for 2016 are estimated to exaFLOPS (1018 Floating Point Operations per Second) while, for economical and ecological reasons, the energy consumption needs to be limited to 20MW. The expected growth in computing power is two orders of magnitude larger than the acceptable increase in energy. A key resource to overcome this energy challenge is given by the new Integrated Circuits technologies: three-dimensional silicon integration will allow more than 1,000 times higher bandwidth communications at low power per channel using local interconnects between die layers and between die stacks. Integrated silicon nanophotonics will provide low-power and high-bandwidth optical interconnections between different parts of the system on a chip, board, and rack levels. A combination of these technologies will likely be required to build exascale systems. In this context, the advanced integration technologies enabled the emerging of microservers: a server may be replaced by a set of microservers, consuming less energy and providing a custom required computation power. The design of future microservers is still an open problem. One of the main open questions is related to the thermal characterization in microservers, since they are based on high-density packed chips where the heat dissipation is poor. Therefore, advanced analysis and modeling tools are required in order to assess the impact of this new technology in future cloud infrastructures. In this context, our proposal concentrates on the definition of an approach for system-level modeling and analysis of systems integrating advanced technologies with direct application to architectural and thermal optimizations in microservers.

由于我们的经济和社会主要基于数字信息，在过去十年中出现了数字宇宙。由于这种演变，云计算和数据中心已经变得无处不在-它们几乎在经济的每个部门都是必不可少的，并且已经成为通信，商业，学术和政府系统的支柱。然而，在不久的将来将面临若干挑战。随着云中新应用的不断涌现和海量数据的处理，对计算性能的要求也在急剧提高。今天的超级计算机的功率以几个PFLOP（每秒1015次浮点运算）表示，一个PFLOP需要1 MW。2016年的需求估计为exaFLOPS（每秒1018次浮点运算），而出于经济和生态原因，能源消耗需要限制在20兆瓦。计算能力的预期增长比可接受的能源增长大两个数量级。新的集成电路技术提供了克服这一能源挑战的关键资源：三维硅集成将允许在每通道低功率下使用管芯层之间和管芯堆叠之间的局部互连进行1,000倍以上的带宽通信。集成硅纳米光子学将在芯片、电路板和机架级别的系统不同部分之间提供低功耗和高带宽的光学互连。这些技术的结合可能需要建立exascale系统。在这种情况下，先进的集成技术使微服务器的出现成为可能：一台服务器可以被一组微服务器取代，消耗更少的能量并提供定制所需的计算能力。未来微服务器的设计仍然是一个悬而未决的问题。其中一个主要的开放问题是有关的热表征微服务器，因为它们是基于高密度封装芯片的散热是穷人。因此，需要先进的分析和建模工具来评估这项新技术在未来云基础设施中的影响。在这种情况下，我们的建议集中在系统级建模和分析的方法的定义，系统集成先进的技术，直接应用到微服务器的架构和热优化。