3D Ceramic Sensors and Circuits

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Advances in technology have greatly influenced all aspects of society in the last twenty-five years. As a result, information technology, medical equipment and consumer products such as cellphones, computers, video recorders, automotive parts, etc. rely heavily on microsystems technology (i.e. microelectronics, photonics, wireless circuits and sensors). Future products will desire systems that are more compact, versatile, functional and less expensive. To achieve this, higher operating frequencies and wider bandwidths become necessary. This research will focus on high speed electronics to create a higher level of integration and functionality using advanced low temperature ceramics. We have developed a unique low temperature ceramic process for depositing thin film, thick film and 3-D ceramics onto integrated circuits (ICs) and printed circuit boards (PCBs). Most ceramics have to be made at around 1000 degrees Celsius or more. This destroys the IC. We can do it at 150 degrees Celsius and maintain the integrity of the IC. No one else has achieved this. This will impact tunable electronics, miniature electronic antennae and filters with the development of appropriate masking methods. We were the first to integrate 3-D ceramics onto ICs and PCBs, reducing product size and cost, and increasing functionality. We will investigate magnetic ceramic materials in our novel low temperature process. This will allow applications to electronics beyond the standard norm because these materials could then be deposited onto ICs and PCBs. The proposed research will assist the Canadian industry in producing and manufacturing smaller, more versatile and less expensive products. This will provide a substantial competitive advantage globally in medical sensors, automotive radar, millimeter wireless LAN like the future 5G phone and medical diagnostics equipment.