3D Ceramic Sensors and Circuits

3D 陶瓷传感器和电路

• 批准号: RGPIN-2014-05225
• 负责人: Freundorfer, Alois
• 金额: $ 1.82万
• 依托单位: Queen's University
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2018
• 资助国家: 加拿大
• 起止时间: 2018-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=651175
• 关键词: 3D; Ceramic; Sensors; Circuits

Advances in technology have greatly influenced all aspects of society in the last twenty-five years. As a result, information technology, medical equipment and consumer products such as cellphones, computers, video recorders, automotive parts, etc. rely heavily on microsystems technology (i.e. microelectronics, photonics, wireless circuits and sensors). Future products will desire systems that are more compact, versatile, functional and less expensive. To achieve this, higher operating frequencies and wider bandwidths become necessary. This research will focus on high speed electronics to create a higher level of integration and functionality using advanced low temperature ceramics.* *We have developed a unique low temperature ceramic process for depositing thin film, thick film and 3-D ceramics onto integrated circuits (ICs) and printed circuit boards (PCBs). Most ceramics have to be made at around 1000 degrees Celsius or more. This destroys the IC. We can do it at 150 degrees Celsius and maintain the integrity of the IC. No one else has achieved this. This will impact tunable electronics, miniature electronic antennae and filters with the development of appropriate masking methods. We were the first to integrate 3-D ceramics onto ICs and PCBs, reducing product size and cost, and increasing functionality. We will investigate magnetic ceramic materials in our novel low temperature process. This will allow applications to electronics beyond the standard norm because these materials could then be deposited onto ICs and PCBs.* *The proposed research will assist the Canadian industry in producing and manufacturing smaller, more versatile and less expensive products. This will provide a substantial competitive advantage globally in medical sensors, automotive radar, millimeter wireless LAN like the future 5G phone and medical diagnostics equipment.

在过去的二十五年里，技术的进步极大地影响了社会的方方面面。因此，信息技术、医疗设备和消费产品，如手机、计算机、录像机、汽车零部件等，严重依赖微系统技术(即微电子、光电子、无线电路和传感器)。未来的产品将要求系统更紧凑、更多功能、更实用、更便宜。为了实现这一点，更高的工作频率和更宽的带宽变得必要。这项研究将专注于高速电子产品，以利用先进的低温陶瓷创造更高水平的集成度和功能性。**我们开发了一种独特的低温陶瓷工艺，用于在集成电路(IC)和印刷电路板(PCB)上沉积薄膜、厚膜和3D陶瓷。大多数陶瓷都必须在1000摄氏度左右或更高的温度下制作。这会摧毁IC。我们可以在150摄氏度的温度下进行，并保持IC的完整性。没有其他人能做到这一点。随着适当掩蔽方法的发展，这将对可调谐电子设备、微型电子天线和滤波器产生影响。我们率先将3D陶瓷集成到IC和印刷电路板上，缩小了产品尺寸和成本，并增加了功能。我们将在我们的新型低温工艺中研究磁性陶瓷材料。这将使电子产品的应用超出标准标准，因为这些材料可以沉积到集成电路和印刷电路板上。**拟议的研究将帮助加拿大工业生产和制造更小、更多功能和更便宜的产品。这将在全球医疗传感器、汽车雷达、毫米无线局域网(如未来的5G手机和医疗诊断设备)方面提供实质性的竞争优势。