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3D Ceramic Sensors and Circuits

3D Ceramic Sensors and Circuits
3D 陶瓷传感器和电路
批准号:
RGPIN-2014-05225
负责人:
Freundorfer, Alois
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2015
资助国家:
加拿大
项目状态:
已结题
起止时间:
2015-01-01 至 2016-12-31

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中文摘要
翻译
在过去的25年里,技术的进步极大地影响了社会的各个方面。因此,信息技术、医疗设备和消费产品,如手机、计算机、录像机、汽车零部件等,严重依赖于微系统技术(即微电子、光子学、无线电路和传感器)。未来的产品将希望系统更紧凑、多用途、功能更强大、更便宜。为了实现这一目标,需要更高的工作频率和更宽的带宽。这项研究将集中在高速电子产品上,利用先进的低温陶瓷来创造更高水平的集成度和功能性。
英文摘要
Advances in technology have greatly influenced all aspects of society in the last twenty-five years. As a result, information technology, medical equipment and consumer products such as cellphones, computers, video recorders, automotive parts, etc. rely heavily on microsystems technology (i.e. microelectronics, photonics, wireless circuits and sensors). Future products will desire systems that are more compact, versatile, functional and less expensive. To achieve this, higher operating frequencies and wider bandwidths become necessary. This research will focus on high speed electronics to create a higher level of integration and functionality using advanced low temperature ceramics. We have developed a unique low temperature ceramic process for depositing thin film, thick film and 3-D ceramics onto integrated circuits (ICs) and printed circuit boards (PCBs). Most ceramics have to be made at around 1000 degrees Celsius or more. This destroys the IC. We can do it at 150 degrees Celsius and maintain the integrity of the IC. No one else has achieved this. This will impact tunable electronics, miniature electronic antennae and filters with the development of appropriate masking methods. We were the first to integrate 3-D ceramics onto ICs and PCBs, reducing product size and cost, and increasing functionality. We will investigate magnetic ceramic materials in our novel low temperature process. This will allow applications to electronics beyond the standard norm because these materials could then be deposited onto ICs and PCBs. The proposed research will assist the Canadian industry in producing and manufacturing smaller, more versatile and less expensive products. This will provide a substantial competitive advantage globally in medical sensors, automotive radar, millimeter wireless LAN like the future 5G phone and medical diagnostics equipment.
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3D Ceramic Sensors and Circuits
  • 批准号:
    RGPIN-2014-05225
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $1.82万
  • 财政年份:
    2018
  • 负责人:
    Freundorfer, Alois
  • 依托单位:
3D Ceramic Sensors and Circuits
  • 批准号:
    RGPIN-2014-05225
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $1.82万
  • 财政年份:
    2017
  • 负责人:
    Freundorfer, Alois
  • 依托单位:
3D Ceramic Sensors and Circuits
  • 批准号:
    RGPIN-2014-05225
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $1.82万
  • 财政年份:
    2016
  • 负责人:
    Freundorfer, Alois
  • 依托单位:
3D Ceramic Sensors and Circuits
  • 批准号:
    RGPIN-2014-05225
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $1.82万
  • 财政年份:
    2014
  • 负责人:
    Freundorfer, Alois
  • 依托单位:
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