Towards 3D high speed circuits

迈向 3D 高速电路

• 批准号: 121867-2008
• 负责人: Freundorfer, Alois
• 金额: $ 2.13万
• 依托单位: Queen's University
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2009
• 资助国家: 加拿大
• 起止时间: 2009-01-01 至 2010-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=422066
• 关键词: Towards; 3D; speed; circuits

Information technology and consumer products such as cellphones, computers, video recorders, automotive parts etc. rely heavily on microsystems technology (i.e. microelectronics, photonics, wireless circuits and sensors). Future products will desire systems that are more compact, versatile, functional and less expensive. Higher operating frequencies and wider bandwidths therefore become necessary. To achieve a higher level of integration, we will focus on 1) high speed electronics using advanced low temperature ceramics and 2) high gain beam-scanning planar antennae.

信息技术和消费产品，如手机、计算机、录像机、汽车零件等，严重依赖微系统技术（即微电子、光子学、无线电路和传感器）。未来的产品将需要更紧凑、多功能、多功能和更便宜的系统。 因此，需要更高的工作频率和更宽的带宽。为了实现更高的集成度，我们将专注于1）使用先进低温陶瓷的高速电子器件和2）高增益波束扫描平面天线。