Establishing protocols for fast, non-destructive, and large-area mapping of strain in semiconductor materials and devices
Establishing protocols for fast, non-destructive, and large-area mapping of strain in semiconductor materials and devices
批准号:
483614-2015
负责人:
Moutanabbir, Oussama
金额:
$1.82万
依托单位国家:
加拿大
项目类别:
Engage Grants Program
财政年份:
2015
资助国家:
加拿大
项目状态:
已结题
起止时间:
2015-01-01 至 2016-12-31
中文摘要
应变工程已成为制造和加工各种电子、
光电器件和光伏器件。为了实施这些技术,已经进行了几个过程
提出在半导体中产生应变,以改善和控制其物理性能
利用应变对带隙结构的影响。这种应变引起的重要性日益增加
器件设计和制造中的带隙工程对制造和制造提出了重大挑战
和表征水平。尤其是后者激起了人们对开发各种产品的兴趣。
光谱和显微技术可精确探测超小型半导体中的应变和应力
装置和结构。迄今为止,传统的菌株表征技术存在许多问题
限制其在半导体器件生产线的日常检查中的使用。
该项目通过建立快速、非破坏性和大面积的应变图来解决这个问题。
各种技术上重要的半导体材料和器件。此流程将实施
通过改进新开发的 Photon 等公司的拉曼成像 (RIMA) 系统。通过这个项目我们
将扩展该仪器的功能,以解决重要的材料和设备检查问题
对于电子、光电、光伏应用至关重要。应变的精确研究
半导体材料将为Photon等公司开拓新的市场机会提供强大的资产
半导体行业。
英文摘要
Strain engineering has been a powerful strategy in fabrication and processing of a variety of electronic,
optoelectronic, and photovoltaic devices. To implement these technologies, several processes have been
proposed to generate strain in semiconductors in order to improve and control their physical properties by
exploiting the influence of strain on the bandgap structure. The increasing importance of this strain-induced
bandgap engineering in design and fabrication of devices has raised significant challenges at both fabrication
and characterization levels. The latter in particular has sparked a surge of interest in developing a variety of
spectroscopic and microscopic techniques to precisely probe strain and stress in ultra small semiconductor
devices and structures. Up to date, conventional strain characterization techniques suffer from a number of
limitations that prevent their use in routine inspection in semiconductor device production lines.
This project addresses this very issue by establishing a fast, non-destructive, and large area mapping of strain in
a variety of technologically important semiconductor materials and devices. This process will be implemented
by improving the newly developed Photon etc.'s system for Raman Imaging (RIMA). Through this project we
will expand the capabilities of this instrument to address materials and devices inspection issues that are of
critical importance for electronic, optoelectronic, photovoltaic applications. A precise study of strain in
semiconductor materials will provide Photon etc. with a strong asset to develop new market opportunities in
semiconductor industry.
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会议论文
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资助金额:$3.35万
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依托单位:
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项目类别:Collaborative Research and Development Grants
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资助金额:$14.43万
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依托单位:
Nanoscale and Quantum Semiconductors
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项目类别:Canada Research Chairs
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资助金额:$7.29万
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财政年份:2018
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负责人:Moutanabbir, Oussama
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依托单位:
Scalable group V two-dimensional materials for mid-infrared optoelectronics
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项目类别:Strategic Projects - Group
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资助金额:$16.38万
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财政年份:2018
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负责人:Moutanabbir, Oussama
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依托单位:
Monolithic multi-junction III-V solar cells with optimal 1 eV subcell
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-
项目类别:Strategic Projects - Group
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资助金额:$16.3万
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财政年份:2018
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