High-performance electromagnetic solver for 3D silicon interposers

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Three-dimensional integration holds great promise for enhancing the performance of integrated circuits, and is of significant interest for Advanced Micro Devices (Markham, ON), one of the leading manufacturers of graphic ASICs (application-specific integrated circuits) for inclusion in computers and graphic cards. The electromagnetic analysis of interconnects in this revolutionary type of circuit is however a formidable task, and is currently very time consuming. The goal of this proposal is to develop a high-performance electromagnetic solver that AMD can use to efficiently design 3D integrated circuits. The proposed research will contribute to the development of faster graphic cards, and help Canada to maintain its leading role in microelectronics.