High-performance electromagnetic solver for 3D silicon interposers

适用于 3D 硅中介层的高性能电磁求解器

• 批准号: 486966-2015
• 负责人: Triverio, Piero
• 金额: $ 2.6万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2016
• 资助国家: 加拿大
• 起止时间: 2016-01-01 至 2017-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=600364
• 关键词: performance; electromagnetic; solver; 3D; silicon

Three-dimensional integration holds great promise for enhancing the performance of integrated circuits, and is of significant interest for Advanced Micro Devices (Markham, ON), one of the leading manufacturers of graphic ASICs (application-specific integrated circuits) for inclusion in computers and graphic cards. The electromagnetic analysis of interconnects in this revolutionary type of circuit is however a formidable task, and is currently very time consuming. The goal of this proposal is to

三维集成为提高集成电路的性能带来了巨大的希望，并引起了先进微设备公司(Markham，On)的极大兴趣，该公司是计算机和显卡所用图形ASIC(专用集成电路)的领先制造商之一。然而，这种革命性类型的电路中的互连的电磁分析是一项艰巨的任务，目前非常耗时。这项提议的目标是