A scalable electromagnetic solver for interconnect networks in 3D integrated circuits

用于 3D 集成电路互连网络的可扩展电磁求解器

• 批准号: 524917-2018
• 负责人: Triverio, Piero
• 金额: $ 2.6万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2018
• 资助国家: 加拿大
• 起止时间: 2018-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=667159
• 关键词: scalable; electromagnetic; solver; interconnect; networks

Three-dimensional integration holds great promise for enhancing the performance of integrated circuits, and is**of significant interest to Advanced Micro Devices (Markham, ON), one of the leading manufacturers of graphic**ASICs (application-specific integrated circuits). The electromagnetic analysis of interconnect networks in 3D**integrated circuits is, however, a formidable task. The goal of this proposal is to develop a scalable and parallel**electromagnetic solver that AMD can use to efficiently design 3D integrated circuits. The proposed research**will contribute to the development of faster graphic cards and processors, helping Canada to strengthen its**competitiveness in the microelectronics market.

三维集成在提高集成电路的性能方面具有很大的潜力，并且是Advanced Micro Devices（Markham，ON）的重要兴趣，Advanced Micro Devices是图形ASIC（专用集成电路）的领先制造商之一。然而，三维集成电路中互连网络的电磁分析是一项艰巨的任务。该提案的目标是开发一个可扩展的并行电磁求解器，AMD可以使用它来有效地设计3D集成电路。拟议的研究 ** 将有助于开发更快的图形卡和处理器，帮助加拿大加强其在微电子市场的竞争力。