课题基金 / 基金详情

PCB film application in injection molding

PCB film application in injection molding
PCB薄膜在注塑中的应用
批准号:
543402-2019
负责人:
Wawrow, Peter
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Applied Research and Development Grants - Level 1
财政年份:
2019
资助国家:
加拿大
项目状态:
已结题
起止时间:
2019-01-01 至 2020-12-31

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中文摘要
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英文摘要
Flexible electronics/circuits enable the manufacturing of smaller products and complex circuitry. The ability to embed these flexible circuits into electronic device casings will increase their manufacturing benefits, making this challenging process in great demand globally. The goal of the proposed project is to develop a proof of concept and working prototype to demonstrate the company's embedded electronics manufacturing capabilities. Knowledge and expertise in designing and building the wireless circuit with a renewable energy source (the prototype) will be transferred from the research team to the company. St. Clair College researchers will benefit from applying electronic circuit knowledge and gain insight into this emerging and competitive field.
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国内基金
海外基金
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    2003
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