Green Printed Circuit Boards for Internet-of-Things
Green Printed Circuit Boards for Internet-of-Things
批准号:
576755-2022
负责人:
Kim, WooSooWS
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Alliance Grants
财政年份:
2022
资助国家:
加拿大
项目状态:
已结题
起止时间:
2022-01-01 至 2023-12-31
中文摘要
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英文摘要
The proposed project involves a joint effort between Dr. Woo Soo Kim's team at Simon Fraser University (SFU) and the international partner, Bendable Electronics group in University of Glasgow (U of G), UK. Dr. Woo Soo Kim's research has focused on the concept of multi-material 3D-printing of electrically conductive materials and 3D PCB with multi-layered PCB manufacturing. His team develops eco-friendly multi-stacked PCB materials with cellulose-composite electronic inks that is compatible with current Printed Circuit Board (PCB) manufacturing processes. The cellulose-based 3D-printing will have potential applications for demanding sustainable manufacturing. The bio-compatible 3D-printable material offers a new paradigm in 3D-printing of disposable electronics, or eco-friendly electronics within a single-building process, promoting simple and low-cost electronics manufacturing technology. Dr. Woo Soo Kim initiated this collaboration with U of G's Professor Ravinder Dahiya, because 3D-printed green battery technology and green electronics in the U of G are globally well-established disposable electronics technologies. By synergizing two teams' expertise, the proposed technology will be successfully demonstrated in near future. The aforementioned synergistic collaboration is targeted to generate a foundation development on 3D printed eco-friendly IoT sensor platform. Therefore, this project enables the applicant to expand this foundation to several different sensor systems by utilizing sustainable 3D-printing technology for wide range 3D-printed electronics' practical applications. With a timely investment, the team will generate a pivotal manufacturing breakthrough, creating a full-fledged manufacturing platform poised to benefit from high chemical stability, low-temperature processing, and low hysteresis. The proposed research presents a new direction within the PCB manufacturing sector. The key to the rapid uptake of highly precise, high-performance PCB-based IoTs lies in the fundamental understanding of the design of 3D-printable materials from a green manufacturing.
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批准号:580287-2022
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项目类别:Alliance Grants
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资助金额:$2.62万
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财政年份:2022
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依托单位:
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