Green Printed Circuit Boards for Internet-of-Things

用于物联网的绿色印刷电路板

• 批准号: 576755-2022
• 负责人: Kim, WooSooWS
• 金额: $ 1.82万
• 依托单位: Simon Fraser University
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=760550
• 关键词: Green; Printed; Circuit; Boards; Internet

The proposed project involves a joint effort between Dr. Woo Soo Kim's team at Simon Fraser University (SFU) and the international partner, Bendable Electronics group in University of Glasgow (U of G), UK. Dr. Woo Soo Kim's research has focused on the concept of multi-material 3D-printing of electrically conductive materials and 3D PCB with multi-layered PCB manufacturing. His team develops eco-friendly multi-stacked PCB materials with cellulose-composite electronic inks that is compatible with current Printed Circuit Board (PCB) manufacturing processes. The cellulose-based 3D-printing will have potential applications for demanding sustainable manufacturing. The bio-compatible 3D-printable material offers a new paradigm in 3D-printing of disposable electronics, or eco-friendly electronics within a single-building process, promoting simple and low-cost electronics manufacturing technology. Dr. Woo Soo Kim initiated this collaboration with U of G's Professor Ravinder Dahiya, because 3D-printed green battery technology and green electronics in the U of G are globally well-established disposable electronics technologies. By synergizing two teams' expertise, the proposed technology will be successfully demonstrated in near future. The aforementioned synergistic collaboration is targeted to generate a foundation development on 3D printed eco-friendly IoT sensor platform. Therefore, this project enables the applicant to expand this foundation to several different sensor systems by utilizing sustainable 3D-printing technology for wide range 3D-printed electronics' practical applications. With a timely investment, the team will generate a pivotal manufacturing breakthrough, creating a full-fledged manufacturing platform poised to benefit from high chemical stability, low-temperature processing, and low hysteresis. The proposed research presents a new direction within the PCB manufacturing sector. The key to the rapid uptake of highly precise, high-performance PCB-based IoTs lies in the fundamental understanding of the design of 3D-printable materials from a green manufacturing.

提议的项目涉及西蒙弗雷泽大学（SFU） Woo Soo Kim博士的团队和国际合作伙伴英国格拉斯哥大学（U of G）的可弯曲电子集团的共同努力。Woo Soo Kim博士的研究重点是导电材料的多材料3D打印概念和多层PCB制造的3D PCB。他的团队开发了环保的多层PCB材料，使用纤维素复合电子墨水，与当前的印刷电路板（PCB）制造工艺兼容。基于纤维素的3d打印将在要求苛刻的可持续制造方面具有潜在的应用。这种生物兼容的3d打印材料为一次性电子产品或环保电子产品的3d打印提供了一个新的范例，促进了简单和低成本的电子制造技术。Woo Soo Kim博士与G大学的Ravinder Dahiya教授发起了这项合作，因为G大学的3d打印绿色电池技术和绿色电子产品是全球公认的一次性电子技术。通过将两个团队的专业知识结合起来，所提出的技术将在不久的将来成功演示。上述协同合作的目标是建立3D打印环保物联网传感器平台的基础开发。因此，该项目使申请人能够通过利用可持续的3d打印技术将该基础扩展到几种不同的传感器系统，以实现广泛的3d打印电子产品的实际应用。通过及时的投资，该团队将产生关键的制造突破，创造一个成熟的制造平台，有望从高化学稳定性，低温加工和低滞后中受益。本研究提出了PCB制造领域的新方向。快速采用高精度，高性能基于pcb的物联网的关键在于从绿色制造中对3d打印材料设计的基本理解。