MEMS devices integration with printed circuit boards (PCBs)

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Micro-Electro-Mechanical-Systems (MEMS) sensors and actuators are designed and built on wafers then diced**into small chips. Each chip is packaged and mounted on the printed circuit board (PCB) that provides the**voltage input and output ports required to operate the MEMS sensors. The role of the PCB interface is to**deliver the driving power and transform the output signal into a readable output. These MEMS sensors change**their mechanical response when triggered by the sensor's target presence. To operate the sensor, two electrical**circuits are required: one to actuate the sensor and the other to detect the change of its response.**The aim of this project is to develop an easy, cheap, and relatively faster MEMS-PCBs integration process. It**also aims to work on smaller scale devices, namely nano-micro-electro-mechanical systems (NEMS), to**integrate them into PCBs. By developing this technology industry partner will be very competitive in MEMS**and NEMS devices market locally and internationally since MEMS devices are currently manufactured using a**carrier wafer fixed and bonded on PCBs, which is difficult and takes time and expensive.