针对现有微机械电子罗盘传感器在加工成本、精度、集成化和数字化等方面存在的不足，提出一种高真空封装的全硅基单芯片单面加工的六轴微机械电子罗盘传感器及其级联式Sigma-delta modulator数字闭环接口电路技术。首先，针对释放窗口结构尺寸、位置拓扑、制备方法和工艺参数对单晶硅微机械结构成型的影响，研究单硅片单面三维微机械组合结构一次成型加工技术；建立六轴微机械电子罗盘传感器理论参数模型，优化结构设计，实现传感器的微型化、集成化、低成本以及制造工艺和IC工艺兼容。其次，针对传感器噪声以及各级电路模块噪声等参数建立闭环接口电路的噪声、非线性模型，并研究提高性能的方法。在上述模型及理论分析的基础上研究其闭环接口电路的FPGA数字化集成实现方法，最后结合高真空封装技术开展相关性能分析和试验研究。本课题的研究对拓展微机械传感器单芯片集成技术，促进微机械电子罗盘传感器发展具有重要理论和现实意义。

In order to resolve the shortcomings of the existing micromachined electronic-compass (E-compass) sensors in fabrication cost, precision, integration and digitization, this project proposed a high vacuum packaged fully silicon-based single-chip front-side sixth-axis micromachined E-compass sensor and cascaded sigma-delta modulator digital closed-loop interface circuit. Firstly, aim at the influence of the releasing mini-holes structure dimensions, location topology, fabrication techniques and process parameters to the monocrystalline silicon micromachined structure, a one-step forming technique of single-wafer-based single-sided three-dimensional micromachined assemble structure is studied.The theoretical parameter model of the six-axis micromachined E-compass sensors is built, the structure design is optimized to realize micromachined E-compass sensors miniaturization, integration, low-cost and fabrication process being compatible with IC process. Secondly, noise and nonlinearity models of micromachined E-compass closed-loop interface circuit are established based on mechanical noise of sensors and circuit module noises in each stage, investigated the methods of improving system performance. Based on the above model and theory analysis, the closed-loop interface circuit digital integrated realized in FPGA chip was research. Finally, combined with high vacuum packaged technology to do micromachined E-compass sensors relevant performance analysis and experimental research. This project has important theoretical and practical significance for extending the micromachined sensors integrating technology and promoting the development of micromachined E-compass sensors.