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CAREER: Interface and Reliability Studies of MEMS and Microelectronics Using New MEMS Instruments

CAREER: Interface and Reliability Studies of MEMS and Microelectronics Using New MEMS Instruments
职业:使用新型 MEMS 仪器进行 MEMS 和微电子学的接口和可靠性研究
批准号:
9734368
负责人:
Taher Saif
金额:
$26.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1998
资助国家:
美国
项目状态:
已结题
起止时间:
1998-06-01 至 2003-05-31

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中文摘要
翻译
小行星9734368 该建议的重点是实验研究MEMS和微电子中常见的故障模式之一,即界面之间的脱粘,通常称为脱粘。 将研究由金属(铝)和绝缘体(二氧化硅)的亚微米膜形成的界面。 为了进行实验,将开发基于MEMS器件的微型仪器。 这些仪器将在为界面研究设计的试样中开始剥离。它们也将自我校准,并将允许测量试样的埃至纳米级位移。 微型仪器和测试样品将同时设计,图案化和共同制造。 ***
英文摘要
9734368 Saif This proposal is focused on experimentally studying one of the commonly occurring failure modes in MEMS and micro electronics, namely debonding between interfaces, often referred to as decohesion. The interface formed by submicron films of a metal (aluminum) and an insulator (silicon dioxide) will be studied. To carry out the experiments, micro instruments will be developed based on MEMS devices. These instruments will initiate debonding in test specimens designed for interfacial studies.They will also self calibrate, and will allow measurements of Angstrom to nanometer scale displacements of the specimens. The micro instrument and the test specimens will be simultaneously designed, patterned and cofabricated. ***
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