CAREER: MEMS Post-Packaging by Localized Heating

9734421林本职业发展计划的目标是成为一名在微电子机械系统(MEMS)领域的优秀教师和研究人员，并在微电子机械系统局部加热后封装方面进行初步研究。该计划的内容包括：1.开发MEMS后封装工艺，采用创新的局部加热方法。2.以创新的学生辅导和外展方式发展MEMS教育袖口。研究计划：MEMS已被公认为对美国经济和竞争力至关重要的下一代技术之一。MEMS是从IC(集成电路)技术中产生的，其中高达95%的制造成本可能来自封装工艺。MEMS封装比IC封装更困难，因为它具有非常规的微机械结构，这使得封装问题变得更加复杂。人们希望开发一种通用的MEMS后封装工艺，能够满足晶圆级工艺、低温、密封和长期稳定性的严格封装要求。本研究的目标是：(1)开发一种适用于预制MEMS晶圆的通用MEMS后封装工艺。(2)为了开发一种创新的局部加热方法，用于拟议的MEMS后封装工艺，目前所有的MEMS封装工艺都是区分大小写的。它们要么需要高温进行粘接，如熔融、阳极或共晶粘合，要么使用非密封级粘合材料(如环氧树脂)的低温工艺。局部加热为解决粘结问题提供了一种新的途径。由于高温可以在局部产生，因此可以实现密封和牢固的结合。同时，键合区域外的温度可以保持在较低的水平。因此，利用局域加热方案可以探索新的结合材料、更好、更快、更强的结合机制。为了确定最佳的键合条件，我们将从电热特性、键合机理和微加工工艺等方面进行理论和数值分析，并结合实验进行研究。微包装的传感器将经过加速测试和监测，以确定长期稳定性。优化后的MEMS后封装工艺可直接应用于MEMS行业。教育计划：职业生涯教育计划包括三个主要部分：1.新课程：将开发两个新的MEMS课程，以加强密歇根大学的MEMS教育，并与现有课程相结合。第一门课程是面向大四/研究生的MEMS概论，重点介绍微机械加工的基本技术，包括MEMS的设计、仿真和制造。第二门课程是面向研究生的高级MEMS课程，重点介绍MEMS实践经验，包括微加工工艺和MEMS测试。在这份职业计划中，我们提出了一套完整的MEMS教育课程，面向机械工程专业的学生。2.创新辅导和外展：将在密歇根大学开展六个创新学生辅导和外展项目，包括“以MEMS为重点的学习小组”、“MEMS夏令营”、“工业实习”、“学生交流计划”、“创新的MEMS设计项目”和“联合研究项目”。3.实验室发展：将在机械工程和应用机械系职业方案下建立一个研究/教学实验室。该实验室将补充固态实验室的现有设施，并将重点放在微电子机械测试(MEMT)上，通过局部加热对MEMS后封装进行初步努力。***

9734421 Lin The objective of this CAREER development plan is for the applicant to become an excellent teacher and researcher in the area of Microelectromechanical Systems (MEMS) with initial research efforts in MEMS post-packaging by localized heating. Elements of this plan include: 1. to develop MEMS post-packaging process with innovative approach of localized heating. 2. to develop MEMS educational cuff iculum with innovative student mentoring and outreach. Research Plan: MEMS has been recognized as one of the next generation technologies that are of critical importance to the economy and competitiveness of the US. MEMS has emerged from IC (Integrated Circuit) technologies, where up to 95% of the manufacturing cost may come from the packaging process. MEMS packaging is more difficult than the IC packaging due to its unconventional natural of "micro mechanical structures" which complicates the packaging issue. It is desired to develop a versatile MEMS post-packaging process that can overcome the rigorous packaging requirements of wafer-level process, low temperature, hermetic sealing and rong-term stability. The objectives of this research are: (1) to develop a versatile MEMS post-packaging process for pre-fabricated MEMS wafers. (2) to develop an innovative approach of localized heating to be used in the proposed MEMS post-packaging process All of the current MEMS packaging processes are case sensitive. They either require high temperature for bonding such as fusion, anodic or eutectic bonding or they use low temperature process with non-hermetic grade bonding materials such as epoxy. Localized heating provides a new approach to solve the bonding problem. Since high temperature can be locally generated, hermetic and strong bonding can be achieved. At the same time, the temperature outside the bonding area can be kept low. Therefore, new bonding materials, better, faster and stronger bonding mechanisms may be explored by using the localized heating scheme. In order to ch aracterize the optimal bonding conditions, theoretical and numerical analysis with experiments on electro-thermal characteristics, bonding mechanisms and micro fabrication processes will be investigated. The micropackaged sensors will be gone through accelerated tests and monitored to determine long-term stability. The optimized MEMS post-packaging process can be directly applicable for MEMS industry. Educational Plan: The CAREER educational plan includes three major parts: 1. New courses: Two new MEMS courses will be developed to strengthen the MEMS education at the University of Michigan and to integrate with the existing curriculum. The first course is Introduction to MEMS for senior/graduate students and it focuses on basic micromachining technologies including design, simulation and manufacturing of MEMS. The second course is Advanced MEMS for graduate students and it emphasizes on MEMS handson experiences including microfabrication processes and MEMS testing. A complete MEMS educational curriculum for students majoring in Mechanical Engineering ftom fteshman to Ph.D. has been proposed in this CAREER Program. 2. Innovative mentoring and outreach: Six programs will be carried out at the University of Michigan for innovative student mentoring and outreach including "MEMS focused study group"; "MEMS Summer Camp"; "Industrial Internship"; "Student Exchanging Program"; "Unde?Wraduate MEMS Design Projects" and "Joint research projects". 3. Laboratory development: A research/teaching laboratory will be established under the CAREER program at the Department of Mechanical Engineering and Applied Mechanics. This laboratory is to complement the existing facilities at the Solid-State laboratory and will emphasize on the micro-electro-mechanical testing (MEMT) with initial efforts on MEMS post-packaging by localized heating. ***