SBIR Phase I: Low Cost Pressure Infiltration Casting Process to Support High Volume Manufacture of Graphite-Metal Thermal Management Components

这个小企业创新研究（SBIR）第一阶段项目将开发一种制造技术，以支持压力渗透铸造工艺，以生产石墨金属材料的大型钢坯。改进后的工艺将大大节省成品零件的成本。迫切需要具有改进热性能的先进材料，以满足当前和未来高功率电子系统的热管理要求。该项目将侧重于发展铸造制造工艺的基本基础和生产具有成本效益的石墨金属材料所需的程序。这种制造技术可以使导热系数大于铜的石墨金属材料系统具有成本效益。由于半导体材料的不断进步、电路物理结构的压缩、封装封装尺寸的减小和开关速度的加快，电子系统的散热率急剧增加。这种正在开发的制造技术的广泛影响可以使石墨金属材料的成本效益制造实现目标热性能，这对于满足现有热管理材料不足的高功率应用的热管理解决方案至关重要。采用铸造技术生产的产品的市场切入点包括：(1)先进的大功率军事和工业系统（如相控阵雷达系统、高能激光系统、功率控制、分配和管理系统）；(2)电信基站和(3)高端计算机（如服务器、工作站等）。这些基于htcc的材料的商业市场将在三到五年的时间内发展，在此期间，石墨金属材料将在军事、工业和商业高功率电子应用的广泛范围内得到广泛应用。

This Small Business Innovation Research (SBIR) Phase I project will develop a manufacturing technology to support the pressure infiltration casting process to produce large billets of a graphite-metal material. The improved process will yield to substantial finished part cost saving. There is a critical need for advanced materials with improved thermal properties capable of meeting the thermal management requirements of current and future high power electronic systems. The project will focus on the development of the fundamental basis for the casting manufacturing process and procedures required to produce cost-effective graphite-metal materials. This manufacturing technology could enable cost effective graphite-metal material systems with a thermal conductivity greater than that of copper. The heat dissipation rate of electronic systems has increased dramatically as a result of ongoing advances in semiconductor materials, compression of circuit physical architecture, size reduction of packaging envelops and faster switching speed. The broader impacts from this manufacturing technology being developed could enable the cost effective manufacture of graphite-metal materials that achieve the target thermal properties critical to satisfying thermal management solutions for high power applications for which existing thermal management materials are inadequate. The market point of entry for product produced by the casting technology include: (1) advanced high power military and industrial systems (e.g., phased-array radar systems; high energy laser systems; power control, distribution and management systems); (2) telecommunication base stations and (3) high end computers (e.g., servers, work stations, etc.). The commercial market for these HTCC-based materials will develop over a three to five year period, during which time graphite-metal materials will achieve widespread use in a broad spectrum of military, industrial, and commercial high power electronic applications.