The mechanical behavior of hybrid organic/inorganic structures for flexible electronics

有机/无机杂化结构的柔性电子学的机械行为摘要本项目将开发实验和模型，以了解有机/无机杂化结构的小功能的机械行为，作为新兴领域的柔性电子学的动机。本项目将研究有机基底上的无机薄膜在单调和循环载荷下的响应，重点关注材料和结构的基本力学。具体的问题，将解决包括聚合物基板上的金属膜的延展性，重点是使用微观结构和粘附力，显着增加金属膜的延展性;和开裂的陶瓷膜的聚合物基板上，重点是开发一种实验方法来确定裂纹驱动力，并研究裂纹的萌生和基板的非弹性变形的影响。 这两组问题都出现在柔性电子产品的最新发展中，并对材料和结构的力学提出了根本性的挑战。

The mechanical behavior of hybrid organic/inorganic structures for flexible electronicsABSTRACTThis project will develop experiments and models to understand the mechanical behavior of organic/inorganic hybrid structures of small features, as motivated by the nascent field of flexible electronics. To focus on fundamental mechanics of materials and structures, the project will study the response of inorganic films on organic substrates under monotonic and cyclic loads. Specific issues that will be addressed include ductility of metal films on polymer substrates, with emphasis on using microstructures and adhesion to markedly increase the ductility of the metal films; and cracking in ceramic films on polymer substrates, with emphasis on developing an experimental method to determine crack driving force, and on studying initiation of the cracks and the effects of inelastic deformation of the substrates. Both sets of issues have emerged in the recent development of flexible electronics, and pose fundamental challenges to the mechanics of materials and structures.