CAREER-EHS: Thermal-Aware Task Scheduling for Embedded Planar and 3D Chip Multiprocessors

许多移动的嵌入式系统被设计成小型和紧凑的以有利于便携性。随着用户对更强大、多功能和集成解决方案的需求不断扩大，设计人员奋进将越来越多的设备封装到小型嵌入式外形中，这要归功于技术的进步。与此同时，微处理器技术已经发展到2D和3D空间的多核处理器时代。可以预见，未来的嵌入式系统和未来的微处理器的婚姻提出了显着增加的功率密度，使热管理的嵌入式处理器的一个关键挑战的幽灵这个职业生涯项目解决这一挑战，并寻求创新的解决方案，以解决嵌入式芯片多处理器（CMP）的热问题。本研究的目的是开发主动式热管理技术，防止温度升高到阈值以上，同时避免性能节流。这与传统技术相反，传统技术仅对热违规做出反应，并且通过强制执行性能调节来冷却处理器。所提出的技术利用不同应用之间热行为的自然差异，并在多个内核之间调度它们，以将芯片温度保持在给定的预算内。这种调度的使命是最大限度地减少片上所有核心的热违规、提高性能并减少过热引起的问题，例如可靠性降低、电路速度低和泄漏功率高。该项目的教育部分力求在一个紧密结合的框架内培训来自不同领域和不同背景的学生。目标是建立广泛的熟悉和未来的专业在嵌入式系统，微架构，操作系统和软件分析领域的准备。

Many mobile embedded systems are designed to be small and compact to favor portability. As the user demand expands for more powerful, versatile, and integrated solutions, the designers endeavor to pack more and more devices into small embedded form factors, thanks to technology advancement. In parallel with this trend, the microprocessor technology has evolved into an era of multicore processor in both 2D and 3D space. As can be foreseen, the marriage of future embedded systems and future microprocessors raises the specter of dramatically increased power density that renders thermal management a key challenge for embedded processorsThis CAREER project addresses this challenge and seeks innovative solutions to tackle thermal problems for embedded chip multiprocessors (CMPs). The objective of this research is to develop proactive thermal management techniques that prevent the temperature from increasing above the threshold and yet avoid performance throttling. This is in contrast to traditional techniques, which only react to thermal violations, and do so by enforcing performance throttling to cool down the processor. The proposed techniques leverage the natural discrepancies in thermal behavior among different applications, and schedule them among multiple cores to keep the chip temperature within a given budget. The mission of such scheduling is to minimize thermal violations across all cores on-chip, improve performance, and diminish overheating-induced problems such as reduced reliability, low circuit speed, and high leakage power. The education component of this project seeks to train students from different fields and with different backgrounds in a tightly integrated framework. The goal is to establish broad familiarity and preparedness for future professions in the field of embedded systems, micoarchitectures, operating systems and software analysis.