ADAMS: Architecture and Design Automation for 3D Multi-core Systems

“本奖项由2009年美国复苏和再投资法案(公法第111-5条)资助。”提案ID：0903432 PI名称：谢，元大：南加州大学园区标题：ADAMS：3D多核系统的架构和设计自动化摘要三维集成电路(3D IC)被认为是未来多核架构设计的一种有前途的解决方案。该项目将研究与建筑探索和设计自动化工具相关的两个交叉研究方向，用于未来的3D多核系统。本课程将探讨内存组件的堆叠以及内存堆叠和互连之间的关系。还将调查为系统提供独特服务的逻辑层的堆叠，例如提高可靠性和高效电源管理。在这些勘探中，PI将考虑不同约束之间的相互作用，例如热分布、性能和成本。为了促进这种探索，将开发一套设计自动化工具包。除了使用模拟和仿真环境进行验证外，该项目还将制造和测试其中一些设计，以证明这些想法的可行性。这项研究将与行业合作伙伴合作进行，使技术能够直接转移到行业。因此，这项研究的结果将对未来的多核设计产生直接影响。参与这项研究的本科生和研究生将得到全能型培训。本研究中开发的工具和技术将用于开发一门关于多核设计的新课程。私人投资促进机构还将组织教程和主要会议，以传播这项工作的成果。

"This award is funded under the American Recovery and Reinvestment Act of 2009(Public Law 111-5)."Proposal ID: 0903432 PI name: Xie, YuanInst: PA St U University Park Title: ADAMS: Architecture and Design Automation for 3D Multi-core SystemsABSTRACTThree-dimensional integrated circuits (3D ICs) are envisioned as a promising solution for future multi-core architecture design. This project will investigate two cross-cutting research thrusts related to architectural exploration and design-automation tools for future 3D multi-core systems. The stacking of memory components and the relationship between memory stacking and interconnect will be explored. The stacking of logic layers that provide distinct service to the system such as improved reliability and efficient power management will also be investigated. The PI will consider the interplay between different constraints such as thermal profiles, performance, and cost in these explorations. To facilitate such explorations, a set of design automation toolsets will be developed. In addition to validation using simulation and emulation environments, the project will fabricate and test some of these designs to demonstrate the feasibility of the ideas. The research will be conducted in collaboration with industrial partners enabling direct transfer of technology to industry. The outcome of this research will, therefore, have a direct impact on future multi-core designs. Undergraduate and graduate students involved in this research will get versatile training. The tools and techniques developed in this research will be used in developing a new course on multi-core design. The PIs will also organize tutorials along with major conferences to disseminate the results from this work.