SHF:Medium:Collaborative Reseach: Electrical-thermal Co-Design of Microfluidically-Cooled 3D IC's
SHF:Medium:Collaborative Reseach: Electrical-thermal Co-Design of Microfluidically-Cooled 3D IC's
批准号:
1302375
负责人:
Ankur Srivastava
金额:
$46.47万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2013
资助国家:
美国
项目状态:
已结题
起止时间:
2013-09-15 至 2018-08-31
中文摘要
本项目的技术目标是开发和完善微流控三维集成电路冷却技术。虽然3D集成为提高电子系统的性能、能效和功能提供了巨大的潜力,但散热的问题却明显加剧。仅靠传统的空气冷却不能满足未来3D集成电路散热的要求。在这个项目中,PI正在研究使用积极的微流控冷却技术来冷却3D IC。该团队由来自马里兰大学和佐治亚理工学院的研究人员组成。佐治亚理工学院的团队将在层间微流控冷却3D IC的制造和建模方面带来重要的专业知识。马里兰团队将带来VLSI设计方法方面的专业知识。这项建议的主要重点是:开发3DIC的微流控嵌入式冷却和电气方面的协同设计技术和工具。这项建议将直接支持不同学科的几名博士生。由于这项提议的跨学科性质,这些学生需要学习与流体学、芯片设计和热管理相关的不同主题。本科生还将通过佐治亚理工学院和马里兰州的各种项目参与进来。这项研究的结果将在电气/计算机工程和机械工程的体面场所发表。工具、模型和实验数据也将在网上提供。私人投资机构计划在各种会议和教育论坛上组织教程。将特别强调通过与地方HBCU合作实现少数群体的参与。
英文摘要
The technical goal of this project is to develop and refine the micro-fluidic 3D IC cooling technology. While 3D integration offers significant potential for improving the performance, energy efficiency and functionality of electronic systems, the problem of heat removal is significantly exacerbated. Conventional air cooling alone would be incapable of addressing the future 3D IC heat removal requirements. In this project, the PIs are investigating use of aggressive micro-fluidic cooling technology for cooling 3D ICs. The team comprises researchers from University of Maryland and Georgia Institute of Technology. The Georgia Tech team would bring forth significant expertise in fabrication and modeling of 3D ICs with interlayer micro-fluidic cooling. The Maryland team will bring forth expertise in VLSI design methodologies. The primary focus of this proposal is: development of techniques and tools for co-design of micro-fluidic embedded cooling and electrical aspects of 3D ICs.This proposal would directly support several PhD students in different disciplines. Because of the cross disciplinary nature of this proposal, these students would need to learn diverse set of topics pertaining to fluidics, chip design and thermal management. Undergraduates will also be involved through various programs at Georgia Tech and Maryland. The outcomes of this research will be published in respectable venues in both electrical/computer engineering and mechanical engineering. The tools, models and experimental data will also be made available on the web. The PIs plan to organize tutorials at various conferences and educational forums. Special emphasis will be givenon minority involvement via collaboration with local HBCUs.
期刊论文(1)
专著(0)
科研奖励(0)
会议论文
DOI:
10.1145/3218603.3218634
发表时间:
2018-07
期刊:
Proceedings of the International Symposium on Low Power Electronics and Design
影响因子:
--
作者:
[Zhiyuan Yang;Ankur Srivastava-]
通讯作者:
Zhiyuan Yang;Ankur Srivastava-
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资助金额:$50.0万
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财政年份:2020
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负责人:Ankur Srivastava
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依托单位:
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批准号:0917057
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财政年份:2007
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负责人:Ankur Srivastava
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