PFI-TT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices

这个创新-技术转化伙伴关系（PFI-TT）项目的更广泛的影响/商业潜力是为更高效和更强大的计算提供更好的冷却。这项技术开发和商业化项目将研究直接在硅上3D打印金属翅片的潜在好处，与标准现有技术相比，可以将冷却性能提高10倍。这项技术可以实现更快、更高功率的计算，特别是对于执行高要求过程的超级计算机，例如训练人工智能系统。研究的目的是为了证明优化印刷工艺、机械粘合/可靠性和散热器设计所带来的性能优势。教育目标是通过行业指导和参与宾厄姆顿大学的XCEED和区域I-Corps项目，培养具有创业精神和领导能力的博士后和学生团队。参与范围将扩大，包括一名LSAMP暑期学生参与研究，并让学生和博士后团队在我们的校园LSAMP系列研讨会上领导一个研讨会，解释他们的创新和创业探索。拟议的项目重点是将在硅衬底上激光打印熔融金属合金Sn3Ag4Ti的研究转化为最小可行产品，以向潜在的开发和战略合作伙伴展示。该工艺包括在硅上沉积一层薄薄的Sn3Ag4Ti粉末层，并将需要冷却鳍的区域暴露给激光加热。随后的铜层，然后沉积在这一层形成高纵横比冷却鳍使用选择性激光熔化。激光快速加热在界面处形成薄的硅化物和金属间膜。将研究使用选择性激光熔化制造整个翅片组件，特别是如何在Sn3Ag4Ti层上沉积高导热铜金属。我们还将测量器件的界面机械性能和热循环性能，这对电子封装的可靠性至关重要。预计下一代封装将采用神经网络技术优化高热流通量散热器的设计。我们的研究将通过改进加工方法、证明长期机械可靠性、优化印刷散热片以在高热通量下实现最小热阻来解决关键的转化挑战。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The broader impact/commercial potential of this Partnerships for Innovation - Technology Translation (PFI-TT) project is to enable better cooling for more efficient and powerful computing. This technology development and commercialization project will investigate the potential benefit of 3D printing metal fins directly onto silicon to enable a 10X improvement in cooling compared to standard existing technologies. This technology may enable faster and higher power computing, especially for supercomputers conducting high demand processes, such as training artificial intelligence systems. The research objective is to demonstrate a performance benefit resulting from the optimization of the printing process, mechanical bonding/reliability, and the heat sink design. The education objective is to train a postdoctoral and student team in the essentials of entrepreneurship and leadership through industry mentorship and participation in Binghamton University’s XCEED and regional I-Corps program. Participation will be broadened by inclusion of an LSAMP summer student in the research, and having the student and postdoc team lead a seminar explaining their innovation and entrepreneurial quest at our campus LSAMP’s seminar series. The proposed project focuses on translating research on laser printing a molten metal alloy, called Sn3Ag4Ti, on a silicon substrate into a minimum viable product for demonstration to potential development and strategic partners. The process includes depositing a thin powder layer of Sn3Ag4Ti onto silicon and exposing the areas where cooling fins are desired to laser heating. Subsequent layers of copper are then deposited onto this layer to form high-aspect ratio cooling fins using selective laser melting. The rapid laser heating forms thin silicide and intermetallic films at the interface. The manufacture of the entire fin assembly using selective laser melting will be researched, specifically how to deposit high thermal conductivity copper metal onto the Sn3Ag4Ti layer. We will also measure the interfacial mechanical properties and thermal cyclability of the device, which are critical to electronic packaging reliability. The design of the heat sink at high heat fluxes, expected in the next generation of packages, will be optimized using neural network techniques. Our research will solve key translational challenges by refining the processing method, demonstrating long-term mechanical reliability, and optimizing the printed heat sink for minimal thermal resistance at high heat fluxes.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.