Integrated sensor for electro-magnetic near-field scanning

本申请项目的主题是开发用于板上平面电路、多芯片模块以及集成电路级的电磁近场扫描的集成探针。因此，嵌入式探头天线将与有源电子器件单片组合，例如匹配缓冲器、放大器、线性预处理和混频器（如果适用）。目标工作频率范围高达10 GHz。双输出探头可同时测量两个场分量，从而显著缩短扫描时间。集成在GaAs基HEMT技术中可提供高渡越频率、低噪声系数，最重要的是，它是一种几乎无损的半绝缘衬底，此外还可通过背面金属化屏蔽电子器件。或者，SiGe HBT技术为CMOS数字信号处理块提供更高水平的集成度和兼容性。该应用项目与美国密苏里-罗拉大学Richard DuBroff教授的NSF提案（致力于探针阵列）以及德国柏林弗劳恩霍夫可靠性和微集成研究所（IZM）的MEDEA+项目降落伞协调。高级系统工程（ASE）帕德博恩，德国，重点是补偿算法以及测量系统方面。

Subject of the applied project is the development of integrated probes for electro-magnetic near-field scanning of planar circuits on board, multi-chip module as well as integrated circuit level. Therefore, miniaturised probe antennae are to be monolithically combined with active electronics, such as matched buffers, amplifiers, linear pre-processing and if applicable mixers. Target operation frequency ranges up to 10 GHz. Double output probes enable significant reduction of scanning time by simultaneous measurement of two field components. Integration in GaAs-based HEMT technology offers high transit frequency, low noise figure, and most importantly a virtually lossless semi-insulating substrate, which in addition shields electronics by backside metallisation. Alternatively, SiGe HBT technology provides higher level of integration and compatibility to CMOS digital signal processing blocks. The applied project is coordinated with an NSF proposal by Prof. Richard DuBroff, University of Missouri-Rolla, United States, working towards probe arrays, and the MEDEA+ project PARACHUTE of Fraunhofer Institute for Reliability and Microintegration (IZM) Berlin, Germany, Dept. Advanced System Engineering (ASE) Paderborn, Germany, focusing on compensation algorithms as well as measurement system aspects.