Piezo health monitoring of adhesive joints

该项目的目的是模拟压电弹性智能单搭接结构的动态时间谐波行为，并获得描述压电效应对单搭接结构一维响应的解耦常微分方程系统。将考虑以下关键因素：(a)附着物厚度的影响；(b)界面分层和弹脆脱粘长度；(c)电场影响；(d)动态时谐负荷和频率区间。所提出的工作的新颖性在于应用力学和复合材料领域：(a)将为双材料结构的湿热压弹性稳态行为的一维分析建立一个新的不耦合微分方程系统；(b)应用于电子工业中具有规定几何、机械和压电性能的不同智能设备。脱粘界面长度的出现将是解决这一问题的新结果。将对结构响应和脱粘长度进行参数化分析，包括几何、力学、压电特性和频率。将提出一些建议和结论。

The aim of the project is to model the dynamic time harmonic behaviour of piezoelastic smart single lap structure and to obtain the uncoupled system of ordinary differential equations describing the piezo-electrical effects on the 1D response of a single lap structure. The following key factors will be taken into account: (a) the influence of the thicknesses of the adherends; (b) the interface delamination and elastic-brittle debond length; (c) influence of electric field; (d) dynamic time harmonic load and frequency intervals. The novelty of the proposed work lies in the fields of applied mechanics and composite materials: (a) a new system of uncoupled differential equations will be worked out for the 1D analysis of the hygrothermalpiezoelastic steady state behaviour of the bi-material structure; (b) Application to different smart devices in electronic industries with prescribed geometrical and mechanical and piezoelectric properties will be done. The appearance of the debond interfacial length will be a new result for this problem. The parametric analysis of the structure response and debond length including geometry, mechanical, piezo-electric characteristics and frequencies will be performed and commented. Some recommendations and conclusions will be done.