High Efficiency and High Accuracy Multi-wire EDM Slicing Method of Monocrystalline Silicon Ingot

研究了单晶硅锭的线切割加工效率高、精度高、加工力小的非接触加工方法。第一年（2002财年）实验制造了单线电极专用放电切片设备。与通常的商用线材电火花加工设备相比，该设备产生的脉冲峰值相对较低，持续时间较长。线速度10m/s，比商用线速度快。与传统的多线锯相比，该设备可以实现几乎相同的加工精度和更快的切削速度。第二年（FY2003），我们在第一年成果的基础上，以高效加工为目的，实验开发了多线电火花切割设备。在这种情况下，传统的ISO脉冲系统无法获得稳定的处理，因为放电浓度是由单线多电源系统观察到的。因此，我们研究了同时脉冲系统，其中所有脉冲在同一时间产生。与ISO脉冲系统相比，这种同步脉冲系统的处理效果更好。在去年（2004财年），我们改进了新开发的多线电火花切割设备，并对其特性进行了研究。通过改变导片位置，重新设置导丝子，改进工液供给方式，可实现稳定加工。结果表明，提高线速度可获得较好的切口形状，适当控制放电条件可获得较好的加工表面。此外，三线电极的去除率与单线电极相同，切口形状也很好。因此，利用本研究开发的新设备，证实了多线电火花加工方法具有单晶硅锭高效率、高精度切片方法的可能性。少

High efficiency and high accuracy slicing method of monocrystalline silicon ingot by wire EDM, in which machining force is relatively small because of non-contact processing, were investigated.In the first year (FY2002), special electrical discharge slicing equipment with one wire electrode was experimentally manufactured. This equipment can generate relatively low peak and long duration pulse compared to usual commercial wire EDM equipment. Besides, wire speed is 10m/s and faster than commercial one. This equipment could realize that machining accuracy was almost same and removal rate was faster compared to conventional multi-wire saw method.In the second year (FY2003), we experimentally developed multi-wire EDM slicing equipment based on the results obtained in the first year for the purpose of high efficiency processing. In the case of this system, stable processing could not be obtained by traditional ISO pulse system, because the concentration of electrical discharge was observed … More by single wire and multi-power supply system. Therefore, we investigated the simultaneous pulse system, in which all pulses were generated at the same time. This simultaneous pulse system lead to better processing results compared to ISO pulse system.In the last year (FY2004), we the improved newly developed multi-wire EDM slicing equipment and investigated its characteristics. Stable processing could be realized by the changing conductivity pieces position, newly setting of wire sub-guide and the improvement of working fluid supplying method. It was cleared that better kerf shape was obtained with increasing the wire speed, and better machined surface was also obtained by controlling electrical discharge condition properly. Moreover, removal rate with three wire electrodes was equal to that with single wire electrode, and kerf shapes also were good. Therefore, it was confirmed that the multi-wire EDM method has the possibility of high efficiency and high accuracy slicing method for monocrystalline silicon ingot by using the new equipment developed in this study. Less